GNM212R61A225MA01D Murata Electronics North America, GNM212R61A225MA01D Datasheet - Page 148

• Manufacturer Part Number: GNM212R61A225MA01D
• Description: CAP 2-ARRAY 2.2UF 10V X5R 0805
• Manufacturer: Murata Electronics North America
• Series: GNMr

Specifications of GNM212R61A225MA01D

• Capacitance: 2.2µF
• Voltage - Rated: 10V
• Dielectric Material: Ceramic
• Number Of Capacitors: 2
• Circuit Type: Isolated
• Temperature Coefficient: X5R
• Tolerance: ±20%
• Mounting Type: Surface Mount
• Package / Case: 0805 (2012 Metric)
• Height: 0.033" (0.85mm)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: GNM212R61A225MA01

23
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
2. Mounting of Chips
3. Soldering
(1) Limit of losing effective area of the terminations and
(2) Flux
146
Notice
Thickness of adhesives applied
Keep thickness of adhesives applied (50-105 m or more)
to reinforce the adhesive contact considering the
thickness of the termination or capacitor (20-70 m) and
the land pattern (30-35 m).
Mechanical shock of the chip placer
When the positioning claws and pick-up nozzle are worn,
the load is applied to the chip while positioning is
concentrated in one position, thus causing cracks,
breakage, faulty positioning accuracy, etc.
Careful checking and maintenance are necessary to
prevent unexpected trouble.
An excessively low bottom dead point of the suction
nozzle imposes great force on the chip during mounting,
causing cracked chips. Please set the suction nozzle's
bottom dead point on the upper surface of the board.
conditions needed for soldering.
Please use it after confirming there is no problem in the
reliability of the product beforehand with the intended
equipment. The residue of flux might cause a decrease in
nonconductivity and the corrosion of an external
electrode, etc.
Continued from the preceding page.
Depending on the conditions of the soldering
temperature and/or immersion (melting time),
effective areas may be lost in some part of the
terminations.
To prevent this, be careful in soldering so that any
possible loss of the effective area on the terminations
will securely remain at a maximum of 25% on all
edge length A-B-C-D-A of part with A, B, C, D, shown
in the Figure below.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
B
C
A
D
Termination
Continued on the following page.
C02E.pdf
07.2.6