SG2524N Microsemi Analog Mixed Signal Group, SG2524N Datasheet - Page 2

• Manufacturer Part Number: SG2524N
• Description: IC PWM POWER SUPPLY SW 16DIP
• Manufacturer: Microsemi Analog Mixed Signal Group

Specifications of SG2524N

• Pwm Type: Voltage Mode
• Number Of Outputs: 2
• Frequency - Max: 400kHz
• Duty Cycle: 49%
• Voltage - Supply: 8 V ~ 40 V
• Buck: Yes
• Boost: No
• Flyback: No
• Inverting: No
• Doubler: Yes
• Divider: No
• Cuk: No
• Isolated: No
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 16-DIP
• Frequency-max: 400kHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Rev 1.1a
Copyright
ABSOLUTE MAXIMUM RATINGS
Input Voltage (+V
Collector Voltage ................................................................ 40V
Logic Inputs ........................................................... -0.3V to 5.5V
Current Limit Sense Inputs ................................... -0.3V to 0.3V
Output Current (each transistor) .................................... 100mA
Reference Load Current .................................................. 50mA
Note 1. Values beyond which damage may occur.
J Package:
N Package:
D Package:
L Package:
RECOMMENDED OPERATING CONDITIONS
Input Voltage (+V
Collector Voltage .......................................................
Error Amp Common Mode Range ..........................
Current Limit Sense Common Mode Range ........
Output Current (each transistor) ...............................
Reference Load Current ...........................................
Oscillator Charging Current ..................................
Note 2: Range over which the device is functional and parameter limits are guaranteed.
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1524 with -55 C
-25 C
case temperatures equal to the ambient temperature.)
Note 3. I
THERMAL DATA
Reference Section
Output Voltage
Line Regulation
Load Regulation
Temperature Stability
Total Output Voltage Range
Short Circuit Current
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
1994
T
L
A
= 0mA
85 C, SG3524 with 0 C
Parameter
IN
IN
) ...................................................
) ............................................................. 42V
(Note 3)
Junction to Case
Junction to Ambient
Junction to Case
Junction to Ambient
Junction to Case
Junction to Ambient
Junction to Case
Junction to Ambient
(Note 7)
(Note 7)
T
A
,
,
,
,
T
V
I
Over Operating Temperature Range
Over Line, Load and Temperature
V
L
(Note 1)
70 C, and +V
J
IN
REF
= 0 to 20mA
JC
,
JC
,
JC
,
JC
,
= 25 C
= 8V to 40V
.................. 30°C/W
.................. 40°C/W
................... 50°C/W
.................. 35°C/W
= 0V
JA
JA
JA
JA
.............. 80°C/W
............. 65°C/W
............ 120°C/W
........... 120°C/W
-0.3V to 0.3V
30 A to 2mA
1.8V to 3.4V
IN
(Note 2)
0 to 50mA
0 to 20mA
Test Conditions
8V to 40V
0V to 40V
= 20V. Low duty cycle pulse testing techniques are used which maintains junction and
2
Oscillator Charging Current ................................................ 5mA
Operating Junction Temperature
Storage Temperature Range ............................. -65 C to 150 C
Pb-free / RoHS Peak Package Solder Reflow Temp (40 sec. max. exposure)... 260 C (+0, -5)
Lead Temperature (Soldering, 10 seconds).................................300°C
Oscillator Frequency Range .........................
Oscillator Timing Resistor (R
Oscillator Timing Capacitor (C
Operating Ambient Temperature Range
Note A. Junction Temperature Calculation: T
Note B. The above numbers for
Hermetic (J, L Packages) ............................................. 150 C
Plastic (N, D Packages) ............................................... 150 C
SG1524 .........................................................
SG2524 ...........................................................
SG3524 ...............................................................
thermal resistance of the package in a standard mount-
ing configuration. The
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
Min. Typ. Max. Min. Typ. Max.
4.80
4.80
25
SG1524/2524
5.00
50
11861 Western Avenue
T
) ........................
T
JC
) ............................
5.20
5.20
150
20
50
50
JA
are maximums for the limiting
numbers are meant to be
4.60
4.60
[phone]
25
J
T
SG3524
= T
A
5.00
50
A
100Hz to 300KHz
125 C, SG2524 with
Garden Grove, CA 92841
1.8K to 100K
+ (P
-55 C to 125 C
-25 C to 85 C
5.40
5.40
D
1nF to 1.0 F
150
30
50
50
FAX: [phone]
0 C to 70 C
x
JA
).
Units
mV
mV
mV
mA
V
V