LX1555MY Microsemi Analog Mixed Signal Group, LX1555MY Datasheet - Page 2

• Manufacturer Part Number: LX1555MY
• Description: IC PWM CURRENT MODE 8.4V 8DIP
• Manufacturer: Microsemi Analog Mixed Signal Group

Specifications of LX1555MY

• Pwm Type: Current Mode
• Number Of Outputs: 1
• Frequency - Max: 500kHz
• Duty Cycle: 48%
• Voltage - Supply: 11 V ~ 25 V
• Buck: Yes
• Boost: Yes
• Flyback: Yes
• Inverting: No
• Doubler: No
• Divider: No
• Cuk: No
• Isolated: Yes
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 8-DIP
• Frequency-max: 500kHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

LX1552/3/4/5
2
Supply Voltage (Low Impedance Source) .................................................................. 30V
Supply Voltage (I
Output Current ............................................................................................................. ±1A
Output Energy (Capacitive Load) ................................................................................ 5µJ
Analog Inputs (Pins 2, 3) ........................................................................... -0.3V to +6.3V
Error Amp Output Sink Current ............................................................................... 10mA
Power Dissipation at T
Operating Junction Temperature
Storage Temperature Range .................................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................ 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
M PACKAGE:
DM PACKAGE:
D PACKAGE:
Y PACKAGE:
PW PACKAGE:
Junction Temperature Calculation: T
The
All of the above assume no ambient airflow
Pb-free / RoHS Peak Package Solder Reflow Temp. (40 second max. exposure)................ 260°C (+0, -5)
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
Ceramic (Y Package) ............................................................................................ 150°C
Plastic (M, DM, D, PW Packages) ........................................................................ 150°C
JA
numbers are guidelines for the thermal performance of the device/pc-board system.
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
A B S O L U T E M A X I M U M R AT I N G S
CC
< 30mA) ......................................................................... Self Limiting
A
= 25°C (DIL-8) ...................................................................... 1W
T H E R M A L D ATA
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
J
U
= T
LTRA
A
+ (P
P
-L
R O D U C T I O N
D
OW
x
JA
JA
JA
JA
JA
JA
S
).
TART
-U
P
C
URRENT
(Note 1)
D
, C
A T A
URRENT
165°C/W
120°C/W
130°C/W
144°C/W
95°C/W
S
-M
H E E T
ODE
PWM
M Package RoHS / Pb-free 100% Matte Tin Lead Finish
COMP
RoHS / Pb-free 100% Matte Tin Lead Finish
R
RoHS / Pb-free 100% Matte Tin Lead Finish
N.C.
N.C.
N.C.
I
N.C.
N.C.
N.C.
SENSE
T
RoHS / Pb-free 100% Matte Tin Lead Finish
/C
V
PACKAGE PIN OUTS
COMP
FB
T
R
COMP
N.C.
N.C.
I
N.C.
SENSE
T
R
/C
COMP
V
I
SENSE
T
R
/C
V
FB
I
T
T
SENSE
/C
V
M & Y PACKAGE
FB
T
FB
DM PACKAGE
PW PACKAGE
T
1
2
3
4
5
6
7
8
9
10
D PACKAGE
(Top View)
(Top View)
(Top View)
(Top View)
1
2
3
4
5
6
7
1
2
3
4
1
2
3
4
14
13
12
11
10
8
7
6
5
9
8
8
7
6
5
20
19
18
17
16
15
14
13
12
11
V
V
OUTPUT
GND
REF
CC
V
V
OUTPUT
GND
V
N.C.
V
V
OUTPUT
GND
PWR GND
Copyright © 1994
REF
CC
REF
CC
C
Rev. 1.0b
N.C.
N.C.
V
N.C.
V
V
OUTPUT
GND
PWR GND
N.C.
REF
CC
C