MC33023DW ON Semiconductor, MC33023DW Datasheet - Page 18

• Manufacturer Part Number: MC33023DW
• Description: IC CTRLR PWM SGL END HF 16-SOIC
• Manufacturer: ON Semiconductor

Specifications of MC33023DW

• Pwm Type: Voltage/Current Mode
• Number Of Outputs: 1
• Frequency - Max: 1MHz
• Duty Cycle: 90%
• Voltage - Supply: 10 V ~ 30 V
• Buck: No
• Boost: No
• Flyback: No
• Inverting: No
• Doubler: No
• Divider: No
• Cuk: No
• Isolated: Yes
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Frequency-max: 1MHz
• Duty Cycle (max): 90 %
• Output Voltage: 5.05 V to 5.15 V
• Output Current: 500 mA
• Mounting Style: SMD/SMT
• Switching Frequency: 1000 KHz
• Operating Supply Voltage: 30 V
• Maximum Operating Temperature: + 105 C
• Fall Time: 30 ns
• Minimum Operating Temperature: - 40 C
• Rise Time: 30 ns
• Synchronous Pin: Yes
• Topology: Flyback, Forward
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

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16
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16
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
B
T
F
D
A
9
8
16 PL
S
0.25 (0.010)
B
B
S
9
8
S
A
K
B
C
M
T
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T
SEATING
PLANE
A
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
SEATING
PLANE
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
M
http://onsemi.com
CASE 751G−03
J
CASE 648−08
DW SUFFIX
C
SOIC−16W
P SUFFIX
PDIP−16
ISSUE C
ISSUE T
18
L
q
M
NOTES:
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSIONS D AND E DO NOT INLCUDE
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
PER ASME Y14.5M, 1994.
MOLD PROTRUSION.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
G
M
A
B
C
D
F
H
J
K
L
S
DIM
A1
A
B
C
D
E
H
h
L
q
e
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
0.110
10.15
10.05
MIN
MILLIMETERS
2.35
0.10
0.35
0.23
7.40
0.25
0.50
0.100 BSC
0.050 BSC
MIN
0
1.27 BSC
INCHES
0
_
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
10.45
10.55
MAX
MAX
0.70
2.65
0.25
0.49
0.32
7.60
0.75
0.90
10
7
_
_
MILLIMETERS
18.80
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
2.54 BSC
1.27 BSC
0
_
19.55
MAX
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
10
MC34023/D
_