FAN5026MTCX Fairchild Semiconductor, FAN5026MTCX Datasheet

FAN5026MTCX

Manufacturer Part Number

FAN5026MTCX

Description

IC CONTROLLER DDR 28TSSOP

Manufacturer

Fairchild Semiconductor

Datasheet

1.FAN5026MTCX.pdf (17 pages)

Specifications of FAN5026MTCX

Applications

Controller, DDR

Voltage - Input

3 ~ 16 V

Number Of Outputs

Voltage - Output

0.9 ~ 5.5 V

Operating Temperature

-40°C ~ 85°C

Mounting Type

Surface Mount

Package / Case

28-TSSOP

Duty Cycle (max)

10 %

Output Voltage

0.9 V to 5.5 V

Mounting Style

SMD/SMT

Switching Frequency

345 KHz

Operating Supply Voltage

5 V

Maximum Operating Temperature

+ 85 C

Minimum Operating Temperature

- 40 C

Synchronous Pin

Topology

Buck

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

FAN5026MTCXTR
FAN5026MTCX_NL
FAN5026MTCX_NLTR
FAN5026MTCX_NLTR

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

FAN5026MTCX

Manufacturer:

FSC

Quantity:

2 500

Company:

Meier Automation Equipment Co., Limited

Part Number:

FAN5026MTCX

Manufacturer:

FAIRCHILD/仙童

Quantity:

20 000

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence. This is a preliminary

notification. A Final PCN will be issued when qualification is complete and data is available.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Chiah, BoonHwa

E-mail: BoonHwa.Chiah@fairchildsemi.com

Phone: 8502357

Implementation of change:

Expected 1st Device Shipment Date: 2008/04/28

Earliest Year/Work Week of Changed Product: 0824

Change Type Description: Mold Compound

Description of Change (From): TSSOP package assembly at all FSC approved manufacturing

locations using non Green mold compound as shown in table 1.

Description of Change (To): TSSOP package assembly at all FSC approved manufacturing

locations using Green mold compound as shown in table 2.

Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is

dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level

interconnect lead-free and RoHS compliance. The referenced material changes have been made

to provide a 'Full Green' (Halogen Free Flame Retardant) package. For additional details on the

corporate wide green initiative please visit our Web site at :

http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same

assembly facilities producing the current non-green products. Package outline drawings of the

affected products remain un-changed. Green products will be fully compliant to all published

data sheet specifications and will be interchangeable with current non-green product. Quality

and reliability will remain at the highest standards already demonstrated with Fairchild's

existing products.

Qual/REL Plan Numbers : Q20070049

Qualification :

To qualify Sumitomo G700K green mold compound as a replacement for Sumitomo

EME 6730B and EME 7050 type B at Amkor for assembly of TSSOP packages for the

system Power and Logic product families.

Technical Contact:

Name: Yeoh, LiangChoon

E-mail: Liang.Yeoh@fairchildsemi.com

Phone: 8502744

FORECAST CHANGE NOTIFICATION

Date Issued On : 2007/11/30

Date Created : 2007/11/28

PCN# : Q4074806

Pg. 1

Related parts for FAN5026MTCX

FAN5026MTCX Summary of contents

Page 1

... This notification is for your information and concurrence. This is a preliminary notification. A Final PCN will be issued when qualification is complete and data is available. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. If you have any questions concerning this change, please contact: ...

Page 2

Change From Change To Qualification Stress Test and Sample Size Detail Device #1 FAN1655MTFX Package: NMTF0 #Leads: 016 Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard DOPL JESD22-A108 125C, 0V HAST2 X JESD22-A110 85%RH, 110C, ...

Page 3

... AEC-Q100-006 155C, -400V HTSL X JESD22-A103 150C SOPL1 X JESD22-A108 150C, 0V THBT X JESD22-A101 85%RH, 85C, 0V 168 TMCL1 X JESD22-A104 -65C, 150C Product Id Description : Affected FSIDs : 74VCX16722MTD FAN5019MTC FAN5026MTCX FAN5236MTC FAN5240MTCX SSTV16859MTD 168 1000 1000 500 Conditions Readpoints Conditions TP1 TP2 1 1 168 1000 168 ...

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