L6713ATR STMicroelectronics, L6713ATR Datasheet - Page 11

IC CTLR 2/3PH W/IMBED DVR 64TQFP

L6713ATR

Manufacturer Part Number
L6713ATR
Description
IC CTLR 2/3PH W/IMBED DVR 64TQFP
Manufacturer
STMicroelectronics
Datasheet

Specifications of L6713ATR

Applications
Controller, Intel VR10, VR11, AMD CPU
Voltage - Input
12V
Number Of Outputs
3
Voltage - Output
0.3 ~ 1.6 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
64-TQFP Exposed Pad, 64-eTQFP, 64-HTQFP, 64-VQFP
Output Current
2 A
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-7764-2
L6713ATR

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
L6713ATR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
L6713ATR
Manufacturer:
ST
Quantity:
4 000
Part Number:
L6713ATR
Manufacturer:
ST
0
Part Number:
L6713ATR /L6713A
Manufacturer:
ST
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L6713A
Table 2.
PAD
56
57
58
59
60
61
62
63
64
VCCDR2
VCCDR3
VCCDR1
PHASE1
LGATE3
LGATE1
Thermal
PGND3
PGND1
N.C.
pad
Pin
Pin description (continued)
Not internally connected.
Channel 2 LS driver supply.
It must be connected to others VCCDRx pins also when using 2-phase
operation.
LS driver supply can range from 5 Vbus up to 12 Vbus, filter with 1 µF MLCC
cap vs. PGND2.
Channel 3 LS driver supply.
It must be connected to others VCCDRx pins.
LS driver supply can range from 5 Vbus up to 12 Vbus, filter with 1 µF MLCC
cap vs. PGND3.
Channel 3 LS driver output. A small series resistor helps in reducing device-
dissipated power.
Channel 3 LS driver return path. Connect to power ground plane.
Channel 1 LS driver return path. Connect to power ground plane.
Channel 1 LS driver output. A small series resistor helps in reducing device-
dissipated power.
Channel 1 LS driver supply.
It must be connected to others VCCDRx pins.
LS driver supply can range from 5 Vbus up to 12 Vbus, filter with 1 µF MLCC
cap vs. PGND1.
Channel 1 HS driver return path.
It must be connected to the HS1 MOSFET source and provides return path for
the HS driver of channel 1.
Thermal pad connects the silicon substrate and makes good thermal contact
with the PCB to dissipate the power necessary to drive the external MOSFETs.
Connect to the PGND plane with several VIAs to improve thermal conductivity.
Function
Pin settings
11/64

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