MAX3355EEUD+T Maxim Integrated Products, MAX3355EEUD+T Datasheet - Page 9

• Manufacturer Part Number: MAX3355EEUD+T
• Description: IC CHARGE PUMP USB OTG 14TSSOP
• Manufacturer: Maxim Integrated Products

Specifications of MAX3355EEUD+T

• Applications: Charge Pump, USB
• Voltage - Input: 2.6 ~ 5.5 V
• Number Of Outputs: 1
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

IEC 1000-4-2 is generally lower than that measured
using the Human Body Model. Figure 3 shows the IEC
1000-4-2 model. The Air-Gap Discharge test involves
approaching the device with a charged probe. The
contact-discharge method connects the probe to the
device before the probe is energized.
The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resis-
tance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. All pins require this protection during
manufacturing. After PC board assembly, the Machine
Model is less relevant to I/O ports.
TOP VIEW
OFFVBUS
STATUS1
STATUS2
ID_OUT
V
N.C.
V
_______________________________________________________________________________________
BUS
CC
Charge Pump and Comparators in UCSP
1
4
5
6
7
2
3
±15kV ESD-Protected USB On-the-Go
MAX3355E
TSSOP
14
13
12
11
10
9
8
Machine Model
C+
C-
GND
SHDN
ID_IN
V
N.C.
L
The MAX3355E charge-pump switching frequency
makes proper layout important to ensure stability and
maintain the output voltage under all loads. For best
performance, minimize the distance between the
capacitors and the MAX3355E.
For the latest application details on UCSP construc-
tion, dimensions, tape-carrier information, printed cir-
cuit board techniques, bump-pad layout, and
recommended reflow temperature profile, as well as
the latest information on reliability testing results, refer
to Maxim Application Note: UCSP–A Wafer-Level
Chip-Scale Package available on Maxim’s web site at
www.maxim-ic.com/ucsp.
TRANSISTOR COUNT: 1601
PROCESS: BiCMOS
TOP VIEW
UCSP Applications Information
C
A
B
V
V
C+
BUS
1
CC
OFFVBUS
ID_OUT STATUS1 STATUS2
C-
2
MAX3355E
UCSP
Pin Configurations
Layout Considerations
Chip Information
SHDN
GND
3
ID_IN
V
4
L
9