MAX1544ETL+ Maxim Integrated Products, MAX1544ETL+ Datasheet - Page 30

• Manufacturer Part Number: MAX1544ETL+
• Description: IC QUICK-PWM DUAL-PHASE 40-TQFN
• Manufacturer: Maxim Integrated Products
• Series: Quick-PWM™r

Specifications of MAX1544ETL+

• Applications: Controller, AMD Hammer
• Voltage - Input: 2 ~ 28 V
• Number Of Outputs: 1
• Voltage - Output: 0.68 ~ 1.55 V
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 40-TQFN Exposed Pad
• Output Voltage: 0.675 V to 1.55 V
• Output Current: 40 A
• Input Voltage: 4 V to 28 V
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Since only the valley current is actively limited, the
actual peak current is greater than the current-limit
threshold by an amount equal to the inductor ripple
current. Therefore, the exact current-limit characteristic
and maximum load capability are a function of the
current-sense resistance, inductor value, and battery
voltage. When combined with the undervoltage protec-
tion circuit, this current-limit method is effective in
almost every circumstance.
There is also a negative current limit that prevents
excessive reverse inductor currents when V
sinking current. The negative current-limit threshold is
set to approximately 120% of the positive current limit,
and therefore tracks the positive current limit when ILIM
is adjusted. When a phase drops below the negative
current limit, the controller immediately activates an on-
time pulse—DL turns off, and DH turns on—allowing
the inductor current to remain above the negative cur-
rent threshold.
The current-limit threshold is adjusted with an external
resistive voltage-divider at ILIM. The current-limit
threshold voltage adjustment range is from 10mV to
75mV. In the adjustable mode, the current-limit thresh-
old voltage is precisely 1/20 the voltage seen at ILIM.
The threshold defaults to 30mV when ILIM is connected
to V
default value is approximately V
Carefully observe the PC board layout guidelines to
ensure that noise and DC errors do not corrupt the cur-
rent-sense signals seen by the current-sense inputs
(C_P, C_N).
The DH and DL drivers are optimized for driving mod-
erately sized, high-side and larger, low-side power
MOSFETs. This is consistent with the low-duty factor
seen in the notebook CPU environment, where a large
V
circuit monitors the DL output and prevents the high-
side FET from turning on until DL is fully off. There must
be a low-resistance, low-inductance path from the DL
driver to the MOSFET gate in order for the adaptive
dead-time circuit to work properly. Otherwise, the
sense circuitry in the Quick-PWM controller interprets
the MOSFET gate as “off” while there is actually charge
still left on the gate. Use very short, wide traces (50 mils
to 100 mils wide if the MOSFET is 1in from the device).
The dead time at the other edge (DH turning off) is
determined by a fixed 35ns internal delay.
The internal pulldown transistor that drives DL low is
robust, with a 0.4Ω (typ) on-resistance. This helps pre-
vent DL from being pulled up due to capacitive cou-
Dual-Phase, Quick-PWM Controller for
AMD Hammer CPU Core Power Supplies
30
IN
CC
- V
______________________________________________________________________________________
. The logic threshold for switchover to the 30mV
OUT
differential exists. An adaptive dead-time
MOSFET Gate Drivers (DH, DL)
CC
- 1V.
OUT
is
pling from the drain to the gate of the low-side
MOSFETs when LX switches from ground to V
Applications with high input voltages and long, induc-
tive DL traces may require additional gate-to-source
capacitance to ensure fast-rising LX edges do not pull
up the low-side MOSFET’s gate voltage, causing shoot-
through currents. The capacitive coupling between LX
and DL created by the MOSFET’s gate-to-drain capaci-
tance (C
C
exceed the minimum threshold voltage:
Lot-to-lot variation of the threshold voltage can cause
problems in marginal designs. Typically, adding
4700pF between DL and power ground (C
Figure 9), close to the low-side MOSFETs, greatly
reduces coupling. Do not exceed 22nF of total gate
capacitance to prevent excessive turn-off delays.
Alternatively, shoot-through currents may be caused by
a combination of fast high-side MOSFETs and slow low-
side MOSFETs. If the turn-off delay time of the low-side
MOSFET is too long, the high-side MOSFETs can turn
on before the low-side MOSFETs have actually turned
off. Adding a resistor less than 5Ω in series with BST
slows down the high-side MOSFET turn-on time, elimi-
nating the shoot-through currents without degrading
the turn-off time (R
high-side MOSFET also reduces the LX node rise time,
thereby reducing EMI and high-frequency coupling
responsible for switching noise.
Figure 9. Optional Gate-Driver Circuitry
RSS
), and additional board parasitics should not
(R
NODE RISE TIME.
(CNL)* OPTIONAL—THE CAPACITOR REDUCES LX TO DL CAPACITIVE COUPLING THAT
CAN CAUSE SHOOT-THROUGH CURRENTS.
RSS
BST
)* OPTIONAL—THE RESISTOR LOWERS EMI BY DECREASING THE SWITCHING
), gate-to-source capacitance (C
V
DD
V
GS TH
PGND
V
BST
(
DH
LX
DL
DD
BST
)
(R
<
in Figure 9). Slowing down the
BST
V
)*
IN
(C
NL



)*
D
C
BST
C
C
BYP
BST
C
RSS
ISS



N
N
H
L
INPUT
(V
L
IN
)
NL
ISS
IN
in
.
-