ADM8839ACP Analog Devices Inc, ADM8839ACP Datasheet - Page 4
![IC CHARGE PUMP REG TFT 20LFCSP](/photos/6/52/65293/505-20-lfcsp_sml.jpg)
ADM8839ACP
Manufacturer Part Number
ADM8839ACP
Description
IC CHARGE PUMP REG TFT 20LFCSP
Manufacturer
Analog Devices Inc
Datasheet
1.ADM8839ACPZ-REEL.pdf
(12 pages)
Specifications of ADM8839ACP
Rohs Status
RoHS non-compliant
Applications
Converter, TFT, LCD
Voltage - Input
2.7 ~ 4.2 V
Number Of Outputs
3
Voltage - Output
-15V, 5V, 15V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-LFCSP
For Use With
ADM8839-EVALZ - BOARD EVALUATION FOR ADM8839
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADM8839ACPZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ADM8839
ABSOLUTE MAXIMUM RATINGS
T
Table 3.
Parameter
Supply Voltage
Input Voltage on Digital Inputs
Output Short-Circuit Duration to GND
Output Voltage
Operating Temperature Range
Power Dissipation
Storage Temperature Range
ESD
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
A
+5 V Output
–15 V Output
+15 V Output
= 25°C, unless otherwise noted.
Rating
−0.3 V to +6.0 V
−0.3 V to +6.0 V
10 sec
0 V to 7.0 V
−17 V to +0.3 V
−0.3 V to +17 V
−40°C to +85°C
50 mW
−65°C to +150°C
Class I
Rev. C | Page 4 of 12
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
20-Lead LFCSP_VQ
θ
JA
is specified for the worst-case conditions, that is, a device
θ
31°C
JA
Unit
°C/W