IR3820MTRPBF International Rectifier, IR3820MTRPBF Datasheet - Page 16

• Manufacturer Part Number: IR3820MTRPBF
• Description: IC REG SYNC BUCK 12A 5X6 15QFN
• Manufacturer: International Rectifier
• Series: SupIRBuck™r
• Type: Step-Down (Buck)r

Specifications of IR3820MTRPBF

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.6 ~ 12 V
• Current - Output: 12A
• Frequency - Switching: 600kHz
• Voltage - Input: 2.5 ~ 21 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 15-PowerVQFN
• Power - Output: 3.7W
• Part Status: Active
• Package: PQFN / 5 x 6
• Circuit: Single Output
• Iout (a): 12
• Switch Freq (khz): 600
• Input Range (v): 2.5 - 21
• Output Range (v): 0.6 - 12
• Ocp Otp Uvlo Pre-bias Soft Start And: PGOOD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: IR3820MTRPBFTR

Programming the Current-Limit
The Current-Limit threshold can be set by
connecting a resistor (R
low-side MOSFET to the OCSet pin. The
resistor can be calculated by using equation (3).
The
coefficient and it should be considered for the
worse case operation. This resistor must be
placed close to the IC, place a small ceramic
capacitor from this pin to power ground (PGnd)
for noise rejection purposes.
11/04/08
Setting the Power Good Threshold
Power Good threshold can be programmed by
using two external resistors (see figure 16).
The following formula can be used to set the
threshold:
Where:
0.38V is reference of the internal comparator
0.9*Vout is selectable threshold for power good,
for this design it is 1.62V.
Select R
Using (18): R
Select R
Use a pull up resistor (4.99K) from PGood pin to
Vcc.
R
Where
υ
I
R
Note
I
where
I
Δ
Δ
I
R
DS(on)
SET
o
SET
SET
1
2
: i
i
R
DS(on)
OCSet
:
:
=10KOhm
=3.09K
Temperatur
=
Max
2
I =
Inductor
=
=
V (
=
:
(I
(12A
L(critical
if
=
=
Use
:
in
0
2
:
o
Output
=3.06KOhm
6.9mΩ
5V
R
-
∗
9 .
V
. 1
7
has
*V
o
9.3
)
∗
=
) 5
is
)
. 0
=
1.5)
ripple
10.5KΩ
∗
out
R
used
38
+
V
e
mΩ
Current
OCSet
∗
in
-
Dependency
Δ
+
V
υ
2
. 0
R
∗
i
V
a
2.1A
DS(on)
L
=
for
current
38
o
for
∗
∗
6.9mΩ
I
V
OCSet
F
SET
low
V
positive
s
=
*R
cc
20.1A
) from drain of the
-
1
side
∗
1
-
.5
-(3)
--(
=
MOSFET
10.35mΩ
19
temperature
)
Layout Consideration
The layout is very important when designing high
frequency switching converters. Layout will affect
noise pickup and can cause a good design to
perform with less than expected results.
Start to place the power components, making all
the connection in the top layer with wide, copper
filled areas.
The inductor, output capacitor and the IR3820
should be as close to each other as possible.
This helps to reduce the EMI radiated by the
power traces due to the high switching currents
through them. Place the input capacitor directly to
the Vin pin of IR3820. To reduce the ESR replace
the single input capacitor with two parallel units.
The feedback part of the system should be kept
away from the inductor and other noise sources.
The
capacitors for Vcc and Vc should be close to their
respective pins. It is important to place the
feedback
resistors and compensation components close to
Fb and Comp pins.
In a multilayer PCB use one layer as a power
ground plane and have a control circuit ground
(analog ground), to which all signals are
referenced. The goal is to localize the high
current path to a separate loop that does not
interfere with the more sensitive analog control
function. These two grounds must be connected
together on the PC board layout at a single point.
The Power QFN is a thermally enhanced
package. Based on thermal performance it is
recommended to use at least a 4-layers PCB. To
effectively remove heat from the device the
exposed pad should be connected to the ground
plane using vias.
critical
components
bypass
IR3820MPbF
components
including
PD-60329
such
feedback
as
16