LM3370TL-3206/NOPB National Semiconductor, LM3370TL-3206/NOPB Datasheet - Page 25

• Manufacturer Part Number: LM3370TL-3206/NOPB
• Description: IC CONV DC-DC 1.3/1.8V 20MICRSMD
• Manufacturer: National Semiconductor
• Series: PowerWise®r
• Type: Step-Down (Buck)r

Specifications of LM3370TL-3206/NOPB

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 2
• Voltage - Output: 1.3V, 1.8V
• Current - Output: 600mA
• Frequency - Switching: 2MHz
• Voltage - Input: 2.7 ~ 5.5 V
• Operating Temperature: -30°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-MicroSMD
• Power - Output: 800mW
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: LM3370TL-3206TR

NOTE: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION” IN THE PACKAGE SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE
(www.national.com)
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACK-
AGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION DG.
20-Bump micro SMD Package, 0.5mm Pitch
NS Package Number TLA20CWA
X1 = 2.047 mm ± 0.030 mm
X2 = 3.000 mm ± 0.030 mm
X3 = 0.600 mm ± 0.075 mm
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