MCP1603-150I/MC Microchip Technology, MCP1603-150I/MC Datasheet - Page 19
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MCP1603-150I/MC
Manufacturer Part Number
MCP1603-150I/MC
Description
IC SYNC BUCK REG 0.5A 1.5V 8DFN
Manufacturer
Microchip Technology
Type
Step-Down (Buck)r
Datasheet
1.MCP1603T-180IOS.pdf
(26 pages)
Specifications of MCP1603-150I/MC
Internal Switch(s)
Yes
Synchronous Rectifier
Yes
Number Of Outputs
1
Voltage - Output
1.5V
Current - Output
500mA
Frequency - Switching
2MHz
Voltage - Input
2.7 ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-DFN
For Use With
MCP1603RD-TNY - REFERENCE DESIGN FOR MCP1603MCP1603EV - BOARD EVAL BUCK CONV MCP1603
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power - Output
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
A
E
NOTE 2
EXPOSED PAD
Units
A1
A3
D2
E2
N
D
A
E
K
e
b
L
L
K
0.80
0.00
1.30
1.50
0.18
0.30
0.20
MIN
MILLIMETERS
b
BOTTOM VIEW
2.00 BSC
3.00 BSC
0.50 BSC
0.20 REF
NOM
0.90
0.02
0.25
0.40
8
–
–
–
Microchip Technology Drawing C04-123B
D2
2
e
1
N
MAX
1.00
0.05
1.75
1.90
0.30
0.50
MCP1603
–
E2
NOTE 1
DS22042A-page 19