LTC3824EMSE#PBF Linear Technology, LTC3824EMSE#PBF Datasheet - Page 12

• Manufacturer Part Number: LTC3824EMSE#PBF
• Description: IC CTLR STP DWN HV 10-MSOP
• Manufacturer: Linear Technology
• Type: Step-Down (Buck)r

Specifications of LTC3824EMSE#PBF

• Internal Switch(s): No
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 0.8 ~ 36 V
• Current - Output: 2A
• Frequency - Switching: 200kHz ~ 400kHz
• Voltage - Input: 4 ~ 60 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP Exposed Pad, 10-HMSOP, 10-eMSOP
• Dc To Dc Converter Type: Step Down
• Pin Count: 10
• Input Voltage: 4 to 60V
• Output Voltage: 0.8 to 36V
• Output Current: 2.5A
• Package Type: MSOP EP
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Primary Input Voltage: 60V
• No. Of Outputs: 1
• No. Of Pins: 10
• Operating Temperature Range: -40°C To +85°C
• Msl: MSL 1 - Unlimited
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Lead Free Status / Rohs Status: Compliant

Typical applicaTion
LTC3824
package DescripTion
12
12.5V TO 60V
(.0120 ± .0015)
0.305 ± 0.038
GAUGE PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
TYP
(.007)
RECOMMENDED SOLDER PAD LAYOUT
0.18
(.206)
5.23
MIN
100V
33µF
V
C
IN
IN1
+
0.254
(.010)
(.074 ± .004)
1.88 ± 0.102
301k
C
2.2µF
100V
DETAIL “A”
IN2
0.1µF
DETAIL “A”
(.066 ± .004)
1.68 ± 0.102
(.0197)
0.50
BSC
SYNC/MODE
R
GND
SS
10-Lead Plastic MSOP , Exposed Die Pad
0° – 6° TYP
SET
(Reference LTC DWG # 05-08-1664 Rev G)
LTC3824
CAP
(.021 ± .006)
V
0.53 ± 0.152
C
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
15k
3.20 – 3.45
C
0.1µF
SENSE
1000pF
12V 2A Buck Converter
CAP
GATE
SEATING
V
V
PLANE
CC
FB
MSE Package
(.118 ± .004)
3.00 ± 0.102
(.007 – .011)
(.193 ± .006)
0.17 – 0.27
4.90 ± 0.152
(NOTE 3)
TYP
100pF
(.043)
MAX
1.10
EXPOSED PAD OPTION
BOTTOM VIEW OF
(.0197)
Q1
R
0.025Ω
0.50
BSC
D1
10
10
S
1
1 2 3 4 5
C
C
C
L1: D104C919AS-330M
D1: SS3H9
Q1: Si7465DP
33µH
1000pF
IN1
IN2
OUT
9
L1
: SANYO 63MV68AX
: TDK C4532X7R2A225M
8
: SANYO OSCON, 16SP270M, TDKC2012X7RIC105K
7 6
68k
DETAIL “B”
(.074)
1.88
(.118 ± .004)
3.00 ± 0.102
(.0196 ± .003)
0.497 ± 0.076
(.034)
(NOTE 4)
0.86
REF
0.1016 ± 0.0508
(.066)
113k
8.06k
1.68
MSOP (MSE) 0910 REV G
(.004 ± .002)
3824 TA02
REF
+
NO MEASUREMENT PURPOSE
THE LEADFRAME FEATURE.
CORNER TAIL IS PART OF
FOR REFERENCE ONLY
C
270µF
OUT
DETAIL “B”
0.05 REF
1µF
16V
X7R
0.29
REF
V
12V
2A
OUT
3824fg