MC34063AP1G ON Semiconductor, MC34063AP1G Datasheet - Page 15

• Manufacturer Part Number: MC34063AP1G
• Description: IC REG SW DC-DC INV 1.5A 8DIP
• Manufacturer: ON Semiconductor
• Type: Step-Down (Buck), Step-Up (Boost), Invertingr

Specifications of MC34063AP1G

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 1.25 ~ 40 V
• Current - Output: 1.5A
• Frequency - Switching: 100kHz
• Voltage - Input: 3 ~ 40 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Power - Output: 1.25W
• Output Current: 1.5 A
• Input Voltage: 3 V to 40 V
• Switching Frequency: 100 KHz
• Operating Temperature Range: 0 C to + 70 C
• Mounting Style: Through Hole
• Current, Input Bias: -20 nA
• Current, Output: 1.5 A
• Current, Supply: 4 mA
• Frequency, Oscillator: 33 kHz
• Package Type: PDIP-8
• Power Dissipation: 1.25 W
• Regulator Type: DC-DC, Switching
• Temperature, Operating, Range: 0 to +70 °C
• Voltage, Input: -0.3 to +40 VDC
• Voltage, Output: 40 VDC
• Voltage, Supply: 40 VDC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC34063AP1GOS

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2X
8X
REFERENCE
2X
NOTE 4
PIN ONE
0.15
0.10
0.08
DETAIL A
0.15
K
C
C
C
e
É É É
É É É
É É É
C
BOTTOM VIEW
SIDE VIEW
TOP VIEW
Ç Ç Ç Ç
Ç Ç Ç Ç
Ç Ç Ç Ç Ç
8
1
DETAIL B
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D2
D
(A3)
Ç
Ç
4
5
A1
8X
B
A
E
E2
8X
b
A
0.10 C
0.05 C
L
C
SEATING
PLANE
EXPOSED Cu
NOTE 3
A B
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
L1
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
Ç Ç
É É
http://onsemi.com
CASE 488AF−01
CONSTRUCTIONS
CONSTRUCTIONS
DFN8, 4x4
DETAIL B
ISSUE C
MOLD CMPD
ALTERNATE
DETAIL A
OPTIONAL
15
*For additional information on our Pb−Free strategy and soldering
L
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A1
4.30
É É Ç Ç
Ç Ç
L
2.39
0.80
PITCH
SOLDERING FOOTPRINT*
A3
NOTES:
1. DIMENSIONS AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. DETAILS A AND B SHOW OPTIONAL
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
PAD AS WELL AS THE TERMINALS.
CONSTRUCTIONS FOR TERMINALS.
2.21
DIM
A1
A3
D2
E2
L1
A
b
D
E
K
L
e
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MILLIMETERS
0.80
0.00
0.25
1.91
2.09
0.20
0.30
MIN
−−−
4.00 BSC
4.00 BSC
0.80 BSC
0.20 REF
DIMENSIONS: MILLIMETERS
MAX
1.00
0.05
0.35
2.21
2.39
0.50
0.15
−−−
0.35
8X
0.63
8X
OUTLINE
PACKAGE
MC34063A/D