MAX1896EUT#TG16 Maxim Integrated Products, MAX1896EUT#TG16 Datasheet - Page 8

• Manufacturer Part Number: MAX1896EUT#TG16
• Description: IC DC-DC CONV STEP UP SOT23-6
• Manufacturer: Maxim Integrated Products
• Type: Step-Up (Boost)r

Specifications of MAX1896EUT#TG16

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 2.6 ~ 13 V
• Current - Output: 500mA
• Frequency - Switching: 1.4MHz
• Voltage - Input: 2.6 ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-6
• Power - Output: 727mW
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 4 shows the MAX1896 in a single-ended primary
inductance converter (SEPIC) topology. This topology
is useful when the input voltage can be either higher or
lower than the output voltage, such as when converting
a single lithium-ion (Li+) cell to a 3.3V output. L1 and
L2 are two windings on a single inductor or two sepa-
rate inductors. The coupling capacitor between these
two windings must be a low-ESR type to achieve maxi-
mum efficiency, and must also be able to handle high
ripple currents. Ceramic capacitors are best for this
application.
1.4MHz SOT23 Current-Mode
Step-Up DC-DC Converter
8
Figure 1. Typical Application Circuit
V
2.6V TO 4.5V
IN
_______________________________________________________________________________________
ON/OFF
33nF
C
SS
SHDN
SS
MAX1896
1-Cell to 3.3V SEPIC Power Supply
IN
GND
LX
FB
CD43-100
SUMIDA
10µH
EC10QSO2L
NIHON
L
Application Circuits
R2
12kΩ
C
10µF
IN
10V
0.1µF
C1
36kΩ
R1
C2
0.1µF
C
22µF
16V
OUT
V
OUT
5V
Good PC board layout and routing are required in high-
frequency switching power supplies to achieve good
regulation, and stability. It is strongly recommended
that the evaluation kit PC board layouts be followed as
closely as possible. Refer to the MAX1896 EV kit for a
good layout. Place power components as close togeth-
er as possible, keeping their traces short, direct, and
wide. Avoid interconnecting the ground pins of the
power components using vias through an internal
ground plane. Instead, keep the power components
close together and route them in a star ground configu-
ration using component side copper, then connect the
star ground to internal ground using multiple vias.
TRANSISTOR COUNT: 970
Chip Information
Layout Procedure