MAX1623EAP Maxim Integrated Products, MAX1623EAP Datasheet - Page 11

• Manufacturer Part Number: MAX1623EAP
• Description: IC REG LV SYNC 3A STEPDWN 20SSOP
• Manufacturer: Maxim Integrated Products
• Type: Step-Down (Buck)r

Specifications of MAX1623EAP

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 1.1 ~ 3.8 V
• Current - Output: 3A
• Frequency - Switching: Up to 350kHz
• Voltage - Input: 4.5 ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP
• Power - Output: 1.3W
• Output Voltage: 1.1 V to 3.8 V
• Input Voltage: 4.5 V to 5.5 V
• Supply Current: 400 uA
• Switching Frequency: 350 KHz
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Stable operation requires the right output filter capaci-
tor. When choosing the output capacitor, ensure the fol-
lowing conditions are met:
and
Good layout is necessary to achieve the intended out-
put power level, high efficiency, and low noise. Good
layout includes the use of a ground plane, appropriate
component placement, and correct routing of traces
using appropriate trace widths. For heatsinking purpos-
es, copper area connected at the IC should be evenly
distributed among the high-current pins.
1) Minimize high-current ground loops. Connect the
Synchronous Rectification and Internal Switches
input capacitor’s ground, output capacitor’s
ground, and IC PGND together.
3A, Low-Voltage, Step-Down Regulator with
C
Circuit Layout and Grounding
______________________________________________________________________________________
2
10mΩ ≤ R
≥
80
×
t
OFF
ESR
×
V
V
Loop Stability
OUT
REF
TRANSISTOR COUNT: 1220
2) A ground plane is essential for optimum perfor-
3) Place the LX node components as close together
4) Connect the input filter capacitor less than 10mm
5) Connect GND directly to PGND at only one point
___________________Chip Information
mance. In most applications, the circuit will be
located on a multilayer board, and full use of the
four or more copper layers is recommended. Use
the top and bottom layers for interconnections and
the inner layers for an uninterrupted ground plane.
as possible. This reduces resistive and switching
losses and confines noise due to ground induc-
tance.
away from IN. The connecting copper trace carries
large currents and must be at least 2mm wide,
preferably 5mm.
near the IC.
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