AGB75LC04-QU-E Amulet Technologies LLC, AGB75LC04-QU-E Datasheet - Page 6

• Manufacturer Part Number: AGB75LC04-QU-E
• Description: IC GUI PROC 24BIT COLOR 208PQFP
• Manufacturer: Amulet Technologies LLC

Specifications of AGB75LC04-QU-E

• Module Size (w X H X T): 28 mm x 28 mm x 3.4 mm
• Operating Temperature Range: - 40 C to + 85 C
• Attached Touch Screen: No
• Product: GUI Processor
• Style: Amulet On-Board Module
• Interface: USB, UART, TWI, SPI
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 681-1017

3.22
3.23
3.24
Note:
1
2
and E1 are maximum plastic body size dimensions including mold mismatch.
3
lead width to exceed the maximum b dimension by more than 0.08 mm. Dambar cannot be located on the lower
radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm.
3.21 Device and 225-ball LFBGA Package Maximum Weight
225-ball LFBGA Package Characteristics
Package Reference
Soldering Information
The top package body size may be smaller than the bottom package size by as much as 0.15 mm
Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1
Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall not cause the
JEDEC Drawing Reference
Moisture Sensitivity Level
Soldering Mask Opening
JESD97 Classification
Ball Land
365.2
0.370 mm to 0.03 mm
0.530 mm +/- 0.03
MO-205
mg
e1
3
Datasheet 2.3X - 0609
AGB75LC04