IDT89HPES34H16ZABL IDT, Integrated Device Technology Inc, IDT89HPES34H16ZABL Datasheet - Page 19
![no-image](/images/manufacturer_photos/0/3/324/idt__integrated_device_technology_inc_sml.jpg)
IDT89HPES34H16ZABL
Manufacturer Part Number
IDT89HPES34H16ZABL
Description
IC PCI SW 34LANE 16PORT 1156FBGA
Manufacturer
IDT, Integrated Device Technology Inc
Datasheet
1.IDT89HPES34H16ZABL.pdf
(45 pages)
Specifications of IDT89HPES34H16ZABL
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
89HPES34H16ZABL
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IDT89HPES34H16ZABL
Manufacturer:
TI
Quantity:
1 154
Company:
Part Number:
IDT89HPES34H16ZABL
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Company:
Part Number:
IDT89HPES34H16ZABLI
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
IDT 89HPES34H16 Data Sheet
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the T
value
J(max)
θ
specified in Table 16. Consequently, the effective junction to ambient thermal resistance (
) for the worst case scenario must be
JA
maintained below the value determined by the formula:
θ
= (T
- T
)/P
JA
J(max)
A(max)
θ
Given that the values of T
, T
, and P are known, the value of desired
becomes a known entity to the system designer. How to
J(max)
A(max)
JA
θ
achieve the desired
is left up to the board or system designer, but in general, it can be achieved by adding the effects of
(value
θ
JA
JC
θ
θ
provided in Table 16), thermal resistance of the chosen adhesive (
), that of the heat sink (
), amount of airflow, and properties of the
CS
SA
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 10 or
more layers AND the board size is larger than 4"x12" AND airflow in excess of 1 m/s is available. It is strongly recommended that users
perform their own thermal analysis for their own board and system design scenarios.
19 of 45
October 21, 2009