IDT89HPES48H12ZABRI IDT, Integrated Device Technology Inc, IDT89HPES48H12ZABRI Datasheet - Page 19

no-image

IDT89HPES48H12ZABRI

Manufacturer Part Number
IDT89HPES48H12ZABRI
Description
IC PCI SW 48LANE 12PORT 1156BGA
Manufacturer
IDT, Integrated Device Technology Inc
Datasheet

Specifications of IDT89HPES48H12ZABRI

Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
89HPES48H12ZABRI

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IDT89HPES48H12ZABRI
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Thermal Considerations
that is relevant to the thermal performance of the PES48H12 switch.
IDT 89HPES48H12 Data Sheet
This section describes thermal considerations for the PES48H12 (35mm
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the T
specified in Table 16. Consequently, the effective junction to ambient thermal resistance (
maintained below the value determined by the formula:
Given that the values of T
achieve the desired
provided in Table 16), thermal resistance of the chosen adhesive (
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 10 or
more layers AND the board size is larger than 4"x12" AND airflow in excess of 1 m/s is available. It is strongly recommended that users
perform their own thermal analysis for their own board and system design scenarios.
θ
Symbol
JA(effective)
T
T
A(max)
J(max)
θ
θ
P
JC
JB
θ
JA
= (T
J(max)
Effective Thermal Resistance, Junction-to-Ambient
θ
- T
JA
Thermal Resistance, Junction-to-Board
Thermal Resistance, Junction-to-Case
A(max)
is left up to the board or system designer, but in general, it can be achieved by adding the effects of
J(max)
Power Dissipation of the Device
Table 16 Thermal Specifications for PES48H12, 35x35mm FCBGA1156 Package
)/P
Junction Temperature
Ambient Temperature
, T
Parameter
A(max)
, and P are known, the value of desired
19 of 48
2
θ
FCBGA1156 package). The data in Table 16 below contains information
CS
Value
12.6
6.82
125
), that of the heat sink (
6.4
5.4
2.1
0.1
70
θ
JA
Units
becomes a known entity to the system designer. How to
Watts
o
o
o
o
o
C/W
C/W
C/W
C/W
C/W
o
o
C
C
θ
JA
) for the worst case scenario must be
θ
SA
Maximum for commercial-rated products
), amount of airflow, and properties of the
Conditions
1 m/S air flow
2 m/S air flow
Zero air flow
Maximum
Maximum
October 7, 2008
J(max)
θ
JC
(value
value

Related parts for IDT89HPES48H12ZABRI