STV0684 STMicroelectronics, STV0684 Datasheet - Page 28

• Manufacturer Part Number: STV0684
• Description: IC COPROCESSR VC5700/6700 196BGA
• Manufacturer: STMicroelectronics

Specifications of STV0684

• Applications: *
• Mounting Type: Surface Mount
• Package / Case: 196-BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 497-3901

STV0684 Package Details
5
5.1
Note: 1 The maximum mounted height is 1.57 mm based on a 0.37 mm ball pad diameter.
28/30
2 LFBGA stands for Low Profile Fine Pitch Ball Grid A rray.
3 The terminal A1 corner must be identitied on the top surface by using a cormer chamfer, ink or
STV0684 Package Details
STV0684 package mechanical data
Solder paste is 0.15 mm thick with 0.37 mm ball pad diameter.
Low profile: The total profile height (Dim A) is measured from the seating plane to the top of the
component. A = [1.21 to 1.70] mm
FIne pitch: e<1.00 mm pitch.
metalized markings or other features of package body or integral heatslug.
A distinguishing feature can be added on the bottom surface of the package to identify the terminal
A1 corner.
Exact shape of each corner is optional.
A
A1
A2
b
D
D1
E
E1
e
f
ddd
Reference
11.850
11.850
1.210
0.270
0.450
0.720
0.650
Min.
Dimensions (mm)
12.000
10.400
12.000
10.400
1.120
0.500
0.800
0.800
Typ.
12.150
12.150
Max.
1.700
0.550
0.880
0.950
0.120
STV0684