NBSG16VSMN ON Semiconductor, NBSG16VSMN Datasheet - Page 2
![IC RCVR/DRIVER SIGE DIFF 16QFN](/photos/38/74/387474/qfn-16_sml.jpg)
NBSG16VSMN
Manufacturer Part Number
NBSG16VSMN
Description
IC RCVR/DRIVER SIGE DIFF 16QFN
Manufacturer
ON Semiconductor
Type
Transceiverr
Datasheet
1.NBSG16VSMNR2G.pdf
(14 pages)
Specifications of NBSG16VSMN
Applications
Instrumentation
Mounting Type
Surface Mount
Package / Case
16-TFQFN Exposed Pad
Logic Family
NBSG
Logic Type
Differential Receiver and Driver
Supply Voltage (max)
- 3.465 V, 3.465 V
Supply Voltage (min)
- 2.375 V, 2.375 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
/ /
Supply Current
32 mA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
NBSG16VSMNOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NBSG16VSMN
Manufacturer:
ON/安森美
Quantity:
20 000
Table 1. PIN DESCRIPTION
1. The NC pin is electrically connected to the die and must be left open.
2. All V
3. In the differential configuration when the input termination pins (VTD, VTD) are connected to a common termination voltage, and if no signal
A1,D1,A4,
C
D
A
B
B3,C3
BGA
bottom (see case drawing) must be attached to a heat−sinking conduit.
is applied then the device will be susceptible to self−oscillation.
N/A
C2
C1
B1
B2
D4
A2
A3
B4
C4
D3
D2
Figure 1. BGA−16 Pinout (Top View)
CC
V
V
D
D
and V
EE
EE
Pin
1
5,8,13,16
EE
QFN
9,12
VTD
VTD
V
10
11
14
15
NC
1
2
3
4
6
7
−
pins must be externally connected to Power Supply to guarantee proper operation. The thermally exposed pad on package
BB
2
V
V
V
V
CTRL
MM
CC
CC
3
Name
V
VTD
VTD
V
V
V
V
NC
CTRL
EP
Q
Q
D
D
MM
CC
EE
BB
V
V
4
Q
Q
EE
EE
ECL, CML,
ECL, CML,
LVCMOS,
LVCMOS,
RSECL
RSECL
LVTTL
LVTTL
Output
Output
LVDS,
LVDS,
Input
Input
I/O
−
−
−
−
−
−
−
−
Internal 50 W Termination Pin. See Table 2.
Inverted Differential Input. Internal 75 kW to V
Noninverted Differential Input. Internal 75 kW to V
Internal 50 W Termination Pin. See Table 2.
Negative Supply Voltage
No Connect
Output Amplitude Swing Control. Bypass Pin to V
Positive Supply Voltage
Noninverted Differential Output. Typically Terminated with 50 W to
V
Inverted Differential Output. Typically Terminated with 50 W to V
LVCMOS Reference Voltage Output. (V
ECL Reference Voltage Output
The Exposed Pad (EP) and the QFN−16 package bottom is thermally connected
to the die for improved heat transfer out of package. The exposed pad must be
attached to a heat−sinking conduit. The pad is not electrically connected to the
die but may be electrically and thermally connected to V
http://onsemi.com
TT
= V
CC
− 2 V
2
VTD
VTD
D
D
Figure 2. QFN−16 Pinout (Top View)
1
2
3
4
V
V
16
EE
EE
5
NBSG16VS
V
NC V
15
BB
6
Description
V
14
CTRL
MM
7
CC
− V
V
V
13
EE
8
EE
EE
EE
and 36.5 kW to V
)/2
EE
CC
.
through 0.1 mF Capacitor.
12
11
10
9
EE
V
Q
Q
V
on the PC board.
CC
CC
Exposed Pad (EP)
TT
CC
= V
.
CC
− 2 V