HCPL-0601-500E Avago Technologies US Inc., HCPL-0601-500E Datasheet - Page 5

• Manufacturer Part Number: HCPL-0601-500E
• Description: OPTOCOUPLER LOG-OUT 10MBD 8SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-0601-500E

• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 50mA
• Data Rate: 10MBd
• Propagation Delay High - Low @ If: 50ns @ 7.5mA
• Current - Dc Forward (if): 20mA
• Input Type: DC
• Output Type: Open Collector
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 50 mA
• Maximum Fall Time: 0.01 us
• Maximum Forward Diode Current: 20 mA
• Minimum Forward Diode Voltage: 1.4 V
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 10 MBd(Typ)
• Maximum Forward Diode Voltage: 1.75 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Power Dissipation: 85 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• No. Of Channels: 1
• Optocoupler Output Type: Logic Gate
• Input Current: 15mA
• Output Voltage: 7V
• Opto Case Style: SOIC
• No. Of Pins: 8
• Supply Voltage Min: 4.5V
• Rohs Compliant: Yes
• External Depth: 6.35mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1774-2; HCPL-0601-500E

Solder Reflow Thermal Profile
Recommended Pb-Free IR Profile
Absolute Maximum Ratings
(No Derating Required up to 85°C)
5
Parameter
Storage Temperature
Operating Temperature
Forward Input Current - I
Reverse Input Voltage - V
Supply Voltage - V
Output Collector Current - I
Output Collector Power Dissipation
Output Collector Voltage - V
Infrared and Vapor Phase Reflow Temperature
TEMPERATURE
(Selection for higher output voltages up to 20 V is available)
ROOM
T
T
smax
smin
300
200
100
T
T
25
CC
p
L
0
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
(1 Minute Maximum)
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
F
R
(see Note 2)
O
O
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
PREHEAT
RAMP-UP
t
s
50
260 +0/-5 °C
3°C + 1°C/–0.5°C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
t
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
PEAK
245°C
Abs. Max.
-55°C to +125°C
-40°C to +85°C
20 mA
5 V
7 V
50 mA
85 mW
7 V
see below
150
SEC.
SEC.
30
30
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T
smax
50 SEC.
SOLDERING
= 200 °C, T
200°C
TIME
200
PEAK
TEMP.
240°C
smin
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
= 150 °C
250