HCPL-0370-000E Avago Technologies US Inc., HCPL-0370-000E Datasheet - Page 5

• Manufacturer Part Number: HCPL-0370-000E
• Description: OPTOCOUPLER AC/DC TO LOGIC 8SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-0370-000E

• Output Type: Open Collector
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 30mA
• Propagation Delay High - Low @ If: 4µs
• Current - Dc Forward (if): 3.7mA
• Input Type: Logic
• Mounting Type: Surface Mount
• Logic Gate Type: AC / DC to Logic Interface Optocouplers
• Configuration: 1 Channel
• Isolation Voltage: 3750 Vrms
• Maximum Propagation Delay Time: 40000 ns
• Maximum Forward Diode Voltage: 50 mA
• Maximum Forward Diode Current: 4.4 mA
• Maximum Continuous Output Current: 30 mA
• Maximum Power Dissipation: 305 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Output Device: Darlington With Base
• Number Of Elements: 1
• Forward Current: 50mA
• Package Type: SOIC
• Collector Current (dc) (max): 30mA
• Power Dissipation: 305mW
• Pin Count: 8
• Mounting: Surface Mount
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• No. Of Channels: 1
• Optocoupler Output Type: Transistor
• Input Current: 50mA
• Output Voltage: 20V
• Opto Case Style: SOIC
• No. Of Pins: 8
• Peak Reflow Compatible (260 C): Yes
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1627

5
Solder Reflow Thermal Profile
Recommended Pb-Free IR Profile
Regulatory Information
The HCPL-0370/3700/3760 has been approved by the following organizations:
IEC/EN/DIN EN 60747-5-5 (with option 060)
Maximum Working Insulation Voltage V
for HCPL-0370, and 630 Vpeak for HCPL3700/3760.
Highest Allowable Overvoltage V
HCPL-0370/3700/3760.
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
ROOM
smax
smin
T
T
25
p
L
= 200 °C, T
150 - 200 °C
217 °C
300
200
100
0
0
t 25 °C to PEAK
PREHEATING RATE 3¡C + 1¡C/Ð0.5¡C/SEC.
REFLOW HEATING RATE 2.5¡C ± 0.5¡C/SEC.
160¡C
150¡C
140¡C
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
IOTM
RAMP-UP
= 150 °C
t
s
= 6000 Vpeak for
260 +0/-5 °C
50
IORM
3¡C + 1¡C/Ð0.5¡C
TIME
= 567 Vpeak
PREHEATING TIME
150¡C, 90 + 30 SEC.
2.5¡C ± 0.5¡C/SEC.
t
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
245¡C
PEAK
UL
Recognized under UL 1577, component recognition
program, File E55361 (HCPL-0370 pending).
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200¡C
TIME
200
PEAK
TEMP.
240¡C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230¡C
250