HCPL-063N-000E Avago Technologies US Inc., HCPL-063N-000E Datasheet - Page 5
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HCPL-063N-000E
Manufacturer Part Number
HCPL-063N-000E
Description
OPTOCPLR LOG-OUT 2CH 10MBD 8SOIC
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-061A-000E.pdf
(17 pages)
Specifications of HCPL-063N-000E
Package / Case
8-SOIC (0.154", 3.90mm Width)
Voltage - Isolation
3750Vrms
Number Of Channels
2, Unidirectional
Current - Output / Channel
50mA
Data Rate
10MBd
Propagation Delay High - Low @ If
53ns @ 3.5mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Open Collector
Mounting Type
Surface Mount
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
50 mA
Maximum Fall Time
0.012 us
Maximum Forward Diode Current
10 mA
Minimum Forward Diode Voltage
1 V
Output Device
Logic Gate Photo IC
Configuration
2 Channel
Maximum Baud Rate
10 MBd(Typ)
Maximum Forward Diode Voltage
1.6 V
Maximum Reverse Diode Voltage
3 V
Maximum Power Dissipation
60 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Number Of Elements
2
Baud Rate
10Mbps
Forward Voltage
1.6V
Forward Current
10mA
Output Current
50mA
Package Type
SOIC
Operating Temp Range
-40C to 85C
Power Dissipation
60mW
Propagation Delay Time
100ns
Pin Count
8
Mounting
Surface Mount
Reverse Breakdown Voltage
3V
Operating Temperature Classification
Industrial
No. Of Channels
2
Optocoupler Output Type
Logic Gate
Input Current
10mA
Output Voltage
7V
Opto Case Style
SOIC
No. Of Pins
8
Common Mode Ratio
15000
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1532-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-063N-000E
Manufacturer:
AVAGO
Quantity:
40 000
TEMPERATURE
HCPL-061A/061N/063A/063N Outline Drawing
Figure 3. 8-Pin Small Outline Package Device Drawing.
Recommended Pb-Free IR Profile
5
Solder Reflow Thermal Profile
Note: Non-halide flux should be used.
ROOM
(0.155 ± 0.005)
(0.016 ± 0.003)
3.937 ± 0.127
0.406 ± 0.076
(0.125 ± 0.005)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
3.175 ± 0.127
5.207 ± 0.254 (0.205 ± 0.010)
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
150 - 200 °C
217 °C
Note: Non-halide flux should be used.
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
8
1
* 5.080 ± 0.127
(0.200 ± 0.005)
t 25 °C to PEAK
3 C/SEC. MAX.
60 to 180 SEC.
smin
7
2
PREHEAT
YWW
RAMP-UP
= 150 °C
XXX
6
3
t
s
50
260 +0/-5 °C
3°C + 1°C/–0.5°C
5
4
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
(0.050)
1.270
(0.236 ± 0.008)
(0.060)
5.994 ± 0.203
1.524
2.5 C ± 0.5°C/SEC.
BSC
t
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
PEAK
245°C
150
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
LAND PATTERN RECOMMENDATION
7
SEC.
SEC.
30
(0.012)
30
0.305
50 SEC.
MIN.
SOLDERING
0.64 (0.025)
45 X
200°C
TIME
200
(0.008 ± 0.004)
0.203 ± 0.102
PEAK
TEMP.
240°C
(0.017)
0.432
1.9 (0.075)
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
7.49 (0.295)
(0.009 ± 0.001)
0.228 ± 0.025
250
Regulatory Information
The HCPL-261A and HCPL-261N
families have been approved by the
following organizations:
UL
Recognized under UL 1577, Com-
ponent Recognition Program, File
E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
(Option 060 only)
Teil 2):2003-01.