HCPL-0501-500E Avago Technologies US Inc., HCPL-0501-500E Datasheet - Page 6
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HCPL-0501-500E
Manufacturer Part Number
HCPL-0501-500E
Description
OPTOCOUPLER TRANS-OUT 1MBD 8SOIC
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0500-000E.pdf
(17 pages)
Specifications of HCPL-0501-500E
Input Type
DC
Package / Case
8-SOIC (0.154", 3.90mm Width)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
8mA
Data Rate
1Mbps
Propagation Delay High - Low @ If
200ns @ 16mA
Current - Dc Forward (if)
25mA
Output Type
Open Collector
Mounting Type
Surface Mount, Gull Wing
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
8 mA
Maximum Forward Diode Current
25 mA
Output Device
Transistor With Base
Configuration
1 Channel
Current Transfer Ratio
50 %
Maximum Baud Rate
1 MBps
Maximum Forward Diode Voltage
1.8 V
Maximum Reverse Diode Voltage
5 V
Maximum Input Diode Current
25 mA
Maximum Power Dissipation
100 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1529-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-0501-500E
Manufacturer:
AVAGO
Quantity:
1 500
Part Number:
HCPL-0501-500E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6)
Solder Reflow Temperature Profile
6
TEMPERATURE
(0.071 ± 0.006)
1.80 ± 0.15
ROOM
300
200
100
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
8
1
160 °C
150 °C
140 °C
(0.442 ± 0.006)
11.23 ± 0.15
7
2
(0.100)
3
6
BSC
2.54
50
4
5
(0.061)
3 °C + 1 °C/–0.5 °C
MAX.
1.55
(0.354 ± 0.006)
(0.158)
9.00 ± 0.15
4.00
150 °C, 90 + 30 SEC.
PREHEATING TIME
MAX.
(0.030 ± 0.010)
0.75 ± 0.25
2.5 C ± 0.5 °C/SEC.
100
LAND PATTERN RECOMMENDATION
TIME (SECONDS)
(0.051)
1.3
245 °C
TEMP.
(0.039 ± 0.006)
PEAK
(0.484 ± 0.012)
1.00 ± 0.15
12.30 ± 0.30
(0.433)
11.00
150
MAX.
SEC.
30
SEC.
30
(0.09)
2.29
7 NOM.
50 SEC.
SOLDERING
(0.534)
13.56
(0.010
200 °C
0.254
TIME
200
PEAK
TEMP.
240 °C
- 0.0051
+ 0.003)
+ 0.076
- 0.002)
TIGHT
TYPICAL
LOOSE
TEMP.
230 °C
PEAK
250