HCPL-4504#560 Avago Technologies US Inc., HCPL-4504#560 Datasheet - Page 7
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HCPL-4504#560
Manufacturer Part Number
HCPL-4504#560
Description
OPTOCOUPLER 1CH VDE GAASP 8-SMD
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-4504-000E.pdf
(19 pages)
Specifications of HCPL-4504#560
Input Type
DC
Package / Case
8-SMD (300 mil)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
8mA
Propagation Delay High - Low @ If
200ns @ 16mA
Current - Dc Forward (if)
25mA
Output Type
Open Collector
Mounting Type
Surface Mount, Gull Wing
Isolation Voltage
3750 Vrms
Output Device
Phototransistor
Configuration
1 Channel
Current Transfer Ratio
65 %
Maximum Baud Rate
1 MBps
Maximum Forward Diode Voltage
1.7 V
Maximum Reverse Diode Voltage
5 V
Maximum Input Diode Current
25 mA
Maximum Power Dissipation
100 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Solder Refl ow Temperature Profi le
Recommended Pb-Free IR Profi le
7
TEMPERATURE
ROOM
T
T
smax
300
200
100
smin
25
T
T
0
p
L
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 °C
smax
217 °C
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
150 - 200 °C
= 200 °C, T
t 25 °C to PEAK
60 to 180 SEC.
smin
PREHEAT
3 °C/SEC. MAX.
= 150 °C
t
s
50
RAMP-UP
* 260 +0/-5 °C
3 °C + 1 °C/–0.5 °C
150 °C, 90 + 30 SEC.
TIME
PREHEATING TIME
t
2.5 C ± 0.5 °C/SEC.
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
245 °C
TEMP.
PEAK
150
SEC.
30
SEC.
30
50 SEC.
SOLDERING
200 °C
TIME
200
PEAK
TEMP.
240 °C
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250