HCPL-T250-000E Avago Technologies US Inc., HCPL-T250-000E Datasheet - Page 5

• Manufacturer Part Number: HCPL-T250-000E
• Description: OPTOCOUPLER DRIVER 1.5A 8-DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-T250-000E

• Output Type: Push-Pull, Totem-Pole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 1.5A
• Propagation Delay High - Low @ If: 270ns @ 7mA ~ 16mA
• Current - Dc Forward (if): 25mA
• Input Type: DC
• Mounting Type: Through Hole
• Configuration: 1 Channel
• Isolation Voltage: 3750 Vrms
• Maximum Propagation Delay Time: 500 ns
• Maximum Forward Diode Voltage: 1.8 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Forward Diode Current: 20 mA
• Maximum Power Dissipation: 250 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 20 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Regulatory Information
The HCPL‑T250 has been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
Insulation and Safety Related
Absolute Maximum Ratings
Notes:
1. Maximum pulse width = 10 µs, maximum duty cycle = 0.2%. See HCPL‑3120 Applications section for additional details on limiting I
2. Derate linearly above 70°C free‑air temperature at a rate of 0.3 mA/°C.
3. Derate lineraly above 70°C free‑air temperature at a rate of 4.8 mW/°C.
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Operating Temperature
“High” Peak Output Current
“High” Peak Output Current
Storage Temperature
Average Input Current
Peak Transient Input Current
(<1 µs Pulse Width, 300 pps)
Reverse Input Voltage
Supply Voltage
Output Voltage
Output Power Dissipation
Lead Solder Temperature
Solder Reflow Temperature Profile
Parameter
Parameter
(Compared with HCPL‑3120)
Symbol
L(101)
L(102)
CTI
(V
I
I
OH(PEAK)
I
OL(PEAK)
Symbol
I
F(TRAN)
CC
F(AVG)
≥175
Value
0.08
V
P
T
T
V
7.1
7.4
IIIa
‑ V
A
O
O
R
S
EE
)
260°C for 10 sec., 1.6 mm below seating plane
Volts
Units
mm
mm
mm
Units
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747‑5‑2:1997 + A1:2002
EN 60747‑5‑2:2001 + A1:2002
DIN EN 60747‑5‑2 (VDE 0884 Teil 2):2003‑01.
(Option 060 only)
mW
mA
°C
°C
See Package Outline Drawings section
A
A
A
V
V
V
Measured from input terminals to
output terminals, shortest distance through
air.
Measured from input terminals to
output terminals, shortest distance path
along body.
Insulation thickness between emitter
and detector; also known as distance
through insulation
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Min.
‑ 40
‑55
0
0
HCPL-3120
Max.
100
125
V
250
2.5
2.5
1.0
Conditions
25
35
5
CC
Min.
‑20
‑55
0
0
HCPL-T250
Max.
125
250
V
1.5
1.5
1.0
85
20
35
5
CC
OH(PEAK)
Note
2
3
1
.