HCPL-0453 Avago Technologies US Inc., HCPL-0453 Datasheet - Page 6

OPTOCOUPLER T-OUT 1MBD 8-SOIC

HCPL-0453

Manufacturer Part Number
HCPL-0453
Description
OPTOCOUPLER T-OUT 1MBD 8-SOIC
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-0453

Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
8mA
Data Rate
1Mbps
Propagation Delay High - Low @ If
200ns @ 16mA
Current - Dc Forward (if)
25mA
Input Type
DC
Output Type
Open Collector
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
No. Of Channels
1
Isolation Voltage
3.75kV
Optocoupler Output Type
Phototransistor
Input Current
16mA
Output Voltage
20V
Opto Case Style
SOIC
No. Of Pins
8
Propagation Delay Low-high
1µs
Ctr Min
19%
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
516-1033-5

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8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW4502/3)
Solder Reflow Temperature Profile
6
(0.070 ± 0.006)
TEMPERATURE
1.78 ± 0.15
ROOM
300
200
100
Dimensions in millimeters (inches).
Lead coplanarity = 0.10 mm (0.004 inches).
Note: Floating lead protrusion is 0.25 mm (10 mils) max.
0
0
Note: Non-halide flux should be used.
8
1
160°C
150°C
140°C
(0.442 ± 0.006)
11.15 ± 0.15
PREHEATING RATE
3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE
2.5°C ± 0.5°C/SEC.
7
2
6
3
(0.100)
2.54
BSC
50
3°C + 1°C/–0.5°C
4
5
150°C, 90 + 30 SEC.
PREHEATING TIME
(0.061)
MAX.
1.55
(0.354 ± 0.006)
(0.158) MAX.
9.00 ± 0.15
2.5 C ± 0.5°C/SEC.
4.00
100
(0.030 ± 0.010)
0.75 ± 0.25
TIME (SECONDS)
LAND PATTERN RECOMMENDATION
TEMP.
245°C
PEAK
150
(0.051)
1.3
(0.039 ± 0.006)
SEC.
30
(0.484 ± 0.012)
SEC.
1.00 ± 0.15
30
(0.433)
12.30 ± 0.30
11.00
50 SEC.
SOLDERING
MAX.
200°C
TIME
200
PEAK
TEMP.
240°C
(0.09)
2.29
7° NOM.
TIGHT
TYPICAL
LOOSE
TEMP.
230°C
PEAK
(0.534)
13.56
(0.010 + 0.003)
0.254 + 0.076
250
- 0.0051
- 0.002)

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