HCPL-0721 Avago Technologies US Inc., HCPL-0721 Datasheet - Page 5
![OPTOCOUPLER CMOS 25MBD 8-SOIC](/photos/7/65/76546/516-8-soic_sml.jpg)
HCPL-0721
Manufacturer Part Number
HCPL-0721
Description
OPTOCOUPLER CMOS 25MBD 8-SOIC
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0720-000E.pdf
(19 pages)
Specifications of HCPL-0721
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
10mA
Data Rate
25MBd
Propagation Delay High - Low @ If
20ns
Input Type
Logic
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
No. Of Channels
1
Isolation Voltage
3.75kV
Optocoupler Output Type
Gate Drive
Input Current
10µA
Output Voltage
5V
Opto Case Style
SOIC
No. Of Pins
8
Propagation Delay Low-high
40ns
Common Mode Voltage Vcm
1000V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
516-1111-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-0721
Manufacturer:
AVAGO
Quantity:
18 000
Part Number:
HCPL-0721
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HCPL-0721#000E
Manufacturer:
AVAGO
Quantity:
30 000
Company:
Part Number:
HCPL-0721#500
Manufacturer:
AGILENT
Quantity:
5 510
Company:
Part Number:
HCPL-0721#500
Manufacturer:
AMD
Quantity:
5 510
Company:
Part Number:
HCPL-0721#500E
Manufacturer:
AVAGO
Quantity:
10 000
Part Number:
HCPL-0721-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Solder Reflow Thermal Profile
Pb-Free IR Profile
Regulatory Information
The HCPL-772X/072X have been approved by the following organizations:
UL
Recognized under UL 1577, component recognition program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884Teil 2):2003-01. (Option 060 only)
5
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
260 +0/-5 °C
3°C + 1°C/–0.5°C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
100
t
TIME (SECONDS)
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250