HCPL-4200#500 Avago Technologies US Inc., HCPL-4200#500 Datasheet - Page 4

• Manufacturer Part Number: HCPL-4200#500
• Description: OPTOCOUPLER 20MA LOOP 8-SMD
• Manufacturer: Avago Technologies US Inc.
• Type: Receiverr

Specifications of HCPL-4200#500

• Package / Case: 8-SMD Gull Wing
• Voltage - Isolation: 3750Vrms
• Input Type: DC
• Voltage - Supply: 4.5 V ~ 20 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Logic Gate Type: AND
• Maximum Baud Rate: 20 KBps
• Configuration: 1 Channel
• Isolation Voltage: 3750 Vrms
• Output Type: Open Collector
• Maximum Propagation Delay Time: 1.6 us
• Maximum Forward Diode Current: 24 mA
• Maximum Continuous Output Current: 25 mA
• Maximum Power Dissipation: 255 mW
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Solder Reflow Thermal Profile
Figure 1a. Solder Reflow Thermal Profile.
Recommended Pb-Free IR Profile
Figure 1b. Pb-Free IR Profile.
Regulatory Information
The HCPL-4200 has been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
4
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
0
p
L
0
= 200 °C, T
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
50
t
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250