PC452J00000F Sharp Microelectronics, PC452J00000F Datasheet - Page 10

PHOTOCOUPLER HI VCE DARL 4-SMD

PC452J00000F

Manufacturer Part Number
PC452J00000F
Description
PHOTOCOUPLER HI VCE DARL 4-SMD
Manufacturer
Sharp Microelectronics
Datasheet

Specifications of PC452J00000F

Number Of Channels
1
Input Type
DC
Voltage - Isolation
3750Vrms
Current Transfer Ratio (min)
1000% @ 1mA
Voltage - Output
350V
Current - Output / Channel
150mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
1.2V
Output Type
Darlington
Mounting Type
Surface Mount
Package / Case
4-SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current Transfer Ratio (max)
-
Other names
425-2145-2
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Flow Soldering :
Hand soldering
Other notices
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
( package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
10
3
Reflow
220˚C or more, 60s or less
4
PC452J00000F Series
(min)
Sheet No.: D2-A00902EN

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