TLP621(GB,F,T) Toshiba, TLP621(GB,F,T) Datasheet - Page 9
![PHOTOCOUPLER TRANS-OUT 4-DIP](/photos/7/69/76960/264-4-dip_sml.jpg)
TLP621(GB,F,T)
Manufacturer Part Number
TLP621(GB,F,T)
Description
PHOTOCOUPLER TRANS-OUT 4-DIP
Manufacturer
Toshiba
Specifications of TLP621(GB,F,T)
Number Of Channels
1
Input Type
DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
100% @ 5mA
Current Transfer Ratio (max)
600% @ 5mA
Voltage - Output
55V
Current - Output / Channel
50mA
Current - Dc Forward (if)
60mA
Vce Saturation (max)
400mV
Output Type
Transistor
Mounting Type
Through Hole
Package / Case
4-DIP (0.300", 7.62mm)
Configuration
1 Channel
Maximum Collector Emitter Voltage
55 V
Maximum Collector Emitter Saturation Voltage
0.4 V
Isolation Voltage
5000 Vrms
Maximum Forward Diode Voltage
1.3 V
Minimum Forward Diode Voltage
1 V
Maximum Collector Current
10 mA
Maximum Power Dissipation
250 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 55 C
Forward Current
16 mA
Maximum Fall Time
3 us
Maximum Input Diode Current
60 mA
Maximum Reverse Diode Voltage
5 V
Maximum Rise Time
2 us
Output Device
Transistor
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TLP621GBTF
Photocoupler Product Tree
3
DIP8
Package
Photocoupler Product Tree
DIP4
Photorelays
Photorelays
2.54SOP4
Triac Output
Thyristor- and Triac-Output
DIP16
SOP4
SO8
2.54SOP6
ZC
DIP6
Transistor-Output
Thyristor Output
SDIP6
SO6
SO16
SOP16
MFSOP6
2.54SOP8
SSOP4
USOP4
Transistor-Output
Output Choices
2.54SOP4
2.54SOP8
MFSOP6
SSOP4
USOP4
SOP16
SDIP6
SOP4
SO16
DIP4
DIP8
SO6
SO8
9
Darlington-Transistor Output
Photovoltaic-Output
Photovoltaic-Output
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2.54SOP6
≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness
6-pin SMD package (1.27-mm lead pitch)
≥ 5-mm clearance/creepage; ≥ 0.4-mm isolation thickness
5-pin SMD package (1.27-mm lead pitch); low-profile
8-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
4-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
SMD package (1.27-mm lead pitch)
SMD package (2.54-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
DIP16
DIP6
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General-purpose packages
Lead-forming options for surface mounting
Logic Output
Gate Drive
IC-Output
GND
GND
Vcc
V
CC