HCPL-817-50AE Avago Technologies US Inc., HCPL-817-50AE Datasheet - Page 4
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HCPL-817-50AE
Manufacturer Part Number
HCPL-817-50AE
Description
ISOLAT 5KVRMS 1CH TRANS 4-SMD GW
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-817-300E.pdf
(7 pages)
Specifications of HCPL-817-50AE
Output Type
Transistor
Input Type
DC
Package / Case
4-SMD Gull Wing
Mounting Type
Surface Mount, Gull Wing
Voltage - Output
70V
Number Of Channels
1
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Voltage - Isolation
5000Vrms
Vce Saturation (max)
200mV
Current Transfer Ratio (max)
160% @ 5mA
Current Transfer Ratio (min)
80% @ 5mA
Maximum Fall Time
18 us
Maximum Input Diode Current
50 mA
Maximum Reverse Diode Voltage
6 V
Maximum Rise Time
18 us
Output Device
Transistor
Configuration
1
Maximum Collector Emitter Voltage
35 V
Maximum Collector Emitter Saturation Voltage
200 mV
Isolation Voltage
5000 Vrms
Current Transfer Ratio
600 %
Maximum Forward Diode Voltage
1.4 V
Maximum Collector Current
50 mA
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 30 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-817-50AE
Manufacturer:
ALTERA
Quantity:
1 000
Part Number:
HCPL-817-50AE
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Part Number:
HCPL-817-50AE/HCPL817-50AE
Manufacturer:
AVAGO/安华高
Quantity:
20 000
HCPL-817-300E
LEAD FREE
Absolute Maximum Ratings (T
4
Solder Reflow Temperature Profile
Note: Non-halide flux should be used.
25°C
(1.6 mm below seating plane)
Total Power Dissipation
Storage Temperature, T
Operating Temperature, T
Lead Solder Temperature, max.
Average Forward Current, I
Reverse Input Voltage, V
Input Power Dissipation, P
Collector Current, I
Collector-Emitter Voltage, V
Emitter-Collector Voltage, V
Collector Power Dissipation
Isolation Voltage, V
ANODE
150°C
Dimensions in Millimeters and (Inches)
60 ~ 150 sec
A 817
Y W W
C
iso
(AC for 1 minute, R.H. = 40 ~ 60%)
200°C
S
R
A
I
F
217°C
CEO
Time (sec)
ECO
6.5 ± 0.5
A
(0.256)
= 25°C)
250°C
RANK
90 sec
DATE CODE
60 sec
260°C (Peak Temperature)
1.2 ± 0.1
30 seconds
(0.047)
60 sec
2.54 ± 0.25
4.6 ± 0.5
(0.181)
(0.1)
–55°C to +125°C
–30°C to +100°C
260°C for 10 s
50 mA
6 V
70 mW
50 mA
70 V
6 V
150 mW
200 mW
5000 Vrms
1. One-time soldering reflow is recommended within the
2. When using another soldering method such as infrared
3.5 ± 0.5
(0.138)
condition of temperature and time profile shown.
ray lamp, the temperature may rise partially in the mold
of thedevice. Keep the temperature on the package of
the device within the condition of (1) above.
0.35 ± 0.25
(0.014)
1.0 ± 0.25
(0.039)
10.16 ± 0.3
7.62 ± 0.3
(0.3)
(0.4)
(0.010)
0.26