PC355NTJ000F Sharp Microelectronics, PC355NTJ000F Datasheet - Page 10

• Manufacturer Part Number: PC355NTJ000F
• Description: PHOTOCOUPLER DARL OUT 4-SMD
• Manufacturer: Sharp Microelectronics

Specifications of PC355NTJ000F

• Number Of Channels: 1
• Input Type: DC
• Voltage - Isolation: 3750Vrms
• Current Transfer Ratio (min): 600% @ 1mA
• Voltage - Output: 35V
• Current - Output / Channel: 80mA
• Current - Dc Forward (if): 50mA
• Vce Saturation (max): 1V
• Output Type: Darlington
• Mounting Type: Surface Mount
• Package / Case: 4-SMD
• No. Of Channels: 1
• Input Current: 20mA
• Output Voltage: 35V
• Opto Case Style: Mini-Flat
• No. Of Pins: 4
• Approval Bodies: UL
• Approval Category: UL Recognised
• Collector Emitter: RoHS Compliant
• Isolation Voltage: 3.75kV
• Configuration: 1
• Maximum Collector Emitter Voltage: 35 V
• Maximum Collector Emitter Saturation Voltage: 1000 mV
• Maximum Forward Diode Voltage: 1.4 V
• Maximum Collector Current: 80 mA
• Maximum Power Dissipation: 170 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 30 C
• Forward Current: 1 mA
• Maximum Fall Time: 250 us
• Maximum Input Diode Current: 50 mA
• Maximum Reverse Diode Voltage: 6 V
• Maximum Rise Time: 300 us
• Output Device: Darlington
• Optocoupler Output Type: Photodarlington
• Svhc: No SVHC (15-Dec-2010)
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current Transfer Ratio (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 425-2576-2; PC355NTJ000F

■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Flow Soldering :
Hand soldering
Other notices
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
( package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
10
3
Reflow
220˚C or more, 60s or less
4
PC355NJ0000F Series
(min)
Sheet No.: D2-A00802EN