PC817X0J000F Sharp Microelectronics, PC817X0J000F Datasheet
PC817X0J000F
Specifications of PC817X0J000F
Related parts for PC817X0J000F
PC817X0J000F Summary of contents
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PC817XJ0000F Series ∗ 4-channel package type is also available. (model No. PC847XJ0000F Series) ■ Description PC817XJ0000F Series contains an IRED optically coupled to a phototransistor packaged in a 4pin DIP, available in wide-lead spacing option and SMT gullwing ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions 1. Through-Hole [ex. PC817XJ0000F] Rank mark Anode mark Factory identification mark Date code C817 2 3 ±0.5 6.5 ±0.3 7.62 Epoxy resin ±0.1 0.26 θ θ θ : ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
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... Model Line-up Lead Form Through-Hole Sleeve Package 100pcs/sleeve PC817XJ0000F PC817X1J000F PC817X2J000F PC817X3J000F PC817X4J000F Model No. PC817X5J000F PC817X6J000F PC817X7J000F PC817X8J000F PC817X9J000F PC817X0J000F SMT Gullwing Lead Form Sleeve Package 100pcs/sleeve PC817XIJ000F PC817XPJ000F PC817XI1J00F PC817XP1J00F PC817XI2J00F PC817XP2J00F PC817XI3J00F PC817XP3J00F PC817XI4J00F PC817XP4J00F Model No. PC817XI5J00F PC817XP5J00F ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 − Ambient temperature T ...
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Fig.7 Forward Current vs. Forward Voltage T =75˚C a 50˚C 100 0.5 1 1.5 2 Forward voltage V Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 I =1mA 100 ...
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Fig.13 Response Time vs. Load Resistance V = =2mA C T =25˚C a 100 0.1 0.01 0.1 1 Load resistance R Fig.15 Frequency Response 0 −10 R =10kΩ L − ...
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Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...
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Package specification ● Sleeve package 1. Through-Hole or SMT Gullwing Lead-Form Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed ...
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Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.4 ...
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Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 24.0 11.5 H ±0.1 12.4 0.4 Reel structure and Dimensions e ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...