TLP181(GB-TPR,F,T) Toshiba, TLP181(GB-TPR,F,T) Datasheet - Page 13

PHOTOCOUPLER TRANS OUT 4-SMD

TLP181(GB-TPR,F,T)

Manufacturer Part Number
TLP181(GB-TPR,F,T)
Description
PHOTOCOUPLER TRANS OUT 4-SMD
Manufacturer
Toshiba
Datasheets

Specifications of TLP181(GB-TPR,F,T)

Number Of Channels
1
Input Type
DC
Voltage - Isolation
3750Vrms
Current Transfer Ratio (min)
100% @ 5mA
Current Transfer Ratio (max)
600% @ 5mA
Voltage - Output
80V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
400mV
Output Type
Transistor
Mounting Type
Surface Mount
Package / Case
4-SMD
Output Device
Transistor
Number Of Elements
1
Reverse Breakdown Voltage
5V
Forward Voltage
1.3V
Forward Current
50mA
Collector-emitter Voltage
80V
Package Type
MFSOP
Collector Current (dc) (max)
50mA
Isolation Voltage
3750Vrms
Power Dissipation
200mW
Collector-emitter Saturation Voltage
0.4V
Current Transfer Ratio
600%
Pin Count
4
Mounting
Surface Mount
Operating Temp Range
-25C to 85C
Operating Temperature Classification
Commercial
Maximum Collector Emitter Voltage
80 V
Maximum Collector Emitter Saturation Voltage
0.4 V
Maximum Forward Diode Voltage
1.3 V
Maximum Collector Current
10 mA
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 55 C
Maximum Fall Time
3 us
Maximum Input Diode Current
50 mA
Maximum Reverse Diode Voltage
5 V
Maximum Rise Time
2 us
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TLP181(GB-TPR)
TLP181GBFTR
TLP181GBTPR
TLP181GBTPRFT
TLP181GBTR
TLP181GBTR
General-Purpose, Transistor-Output Photocouplers (Continued)
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
TLP628-2
TLP628-4
TLP629
TLP629-2
TLP629-4
TLP631
TLP632
TLP731
TLP732
TLP733
TLP733F
Part Number
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
TÜV and VDE: : Approved
For the latest information, please contact your nearest Toshiba sales representative.
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
EN 60747-5-2-approved with option V4 or D4
16
16
1
1
Pin Configuration
8
1
8
1
15
15
2
2
6
1
6
1
6
1
6
1
6
1
14
14
3
3
4
1
7
2
7
2
13
13
4
4
5
2
5
2
5
2
5
2
5
2
12
12
5
5
6
3
6
3
3
2
: Design which meets safety standard/approval pending as of January 2011
11
11
6
6
4
3
4
3
4
3
4
3
4
3
10
10
7
7
5
4
5
4
9
8
9
8
DIP8
Dual-channel version
of the TLP628
DIP16
4-channel version of
the TLP628
DIP4
High input current
I
DIP8
Dual-channel version
of the TLP629
DIP16
4-channel version of
the TLP629
DIP6
Internal base
connection
DIP6
High EMI immunity
DIP6
SEMKO-approved
Internal base
connection
DIP6
SEMKO-approved
DIP6
SEMKO-approved
Internal base
connection
F
=
150 mA
Features
: Approved (reinforced insulation)
Rank
GB
GR
GB
GR
GB
GR
GB
GR
GB
GR
GB
GB
13
100
100
100
100
100
100
100
100
Min
100
100
100
100
50
50
50
50
50
20
20
20
50
50
CTR (%)
Max
600
600
600
600
600
600
300
600
600
300
600
600
300
600
600
300
600
600
300
80
80
80
(3)
@I
: Design which meets safety standard/approval pending as of January 2011
100 mA,
100 mA,
100 mA,
5 mA,
5 mA,
5 mA,
5 mA,
5 mA,
5 mA,
5 mA,
F
5 V
5 V
1 V
1 V
1 V
5 V
5 V
5 V
5 V
5 V
, V
CE
350 V
350 V
V
55 V
55 V
55 V
55 V
55 V
55 V
55 V
55 V
CEO
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
5000
5000
5000
5000
5000
5000
5000
4000
4000
4000
BVs
UL/
/
/
/
/
C
/ –
/ –
/ –
/ –
/ –
/ –
UL
TÜV
Safety Standards
VDE
BSI
(2)
IEC

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