PC357N2 Sharp Microelectronics, PC357N2 Datasheet - Page 10
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PC357N2
Manufacturer Part Number
PC357N2
Description
PHOTOCOUPLER 1CH TRAN OUT 4-SMD
Manufacturer
Sharp Microelectronics
Datasheet
1.PC357N.pdf
(14 pages)
Specifications of PC357N2
Number Of Channels
1
Input Type
DC
Voltage - Isolation
3750Vrms
Current Transfer Ratio (min)
50% @ 5mA
Current Transfer Ratio (max)
600% @ 5mA
Voltage - Output
80V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
200mV
Output Type
Transistor
Mounting Type
Surface Mount
Package / Case
4-SMD
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
425-1331-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PC357N2
Manufacturer:
SHARP
Quantity:
500
Part Number:
PC357N2
Manufacturer:
SHARP/夏普
Quantity:
20 000
Company:
Part Number:
PC357N2J000E
Manufacturer:
SHARP
Quantity:
1 948
Company:
Part Number:
PC357N2J000F
Manufacturer:
SANYO
Quantity:
11 350
Part Number:
PC357N2T-B
Manufacturer:
SHARP
Quantity:
20 000
Part Number:
PC357N2TJ00F
Manufacturer:
SHART
Quantity:
20 000
Part Number:
PC357N2TJ00F B
Manufacturer:
SHARP/夏普
Quantity:
20 000
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Flow Soldering :
Hand soldering
Other notices
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
( package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
10
3
Reflow
220˚C or more, 60s or less
4
(min)
PC357N Series
Sheet No.: D2-A00101EN