PC3H7D Sharp Microelectronics, PC3H7D Datasheet
PC3H7D
Specifications of PC3H7D
Available stocks
Related parts for PC3H7D
PC3H7D Summary of contents
Page 1
PC3H7 Series ∗ 4-channel package type is also available. (model No. PC3Q67) ■ Description PC3H7 Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin Mini-flat package, Half ptich type. Input-output isolation voltage(rms) is 2.5kV. ...
Page 2
Internal Connection Diagram 1 2 ■ Outline Dimensions SHARP mark "S" Anode mark Date code ±0.2 4.4 ±0.3 5.3 (1.7) +0.4 0.5 −0.2 +0.2 7.0 −0 Reference Dimensions Anode ...
Page 3
Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
Page 4
Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
Page 5
... Model Line-up Taping Package 3 000pcs/reel VDE0884 - Approved PC3H7 PC3H7Y PC3H7A PC3H7Y1 PC3H7B PC3H7Y2 PC3H7C PC3H7Y3 PC3H7D PC3H7Y4 PC3H7AB PC3H7Y5 Model No. PC3H7BC PC3H7Y6 PC3H7CD PC3H7Y7 PC3H7AC PC3H7Y8 PC3H7BD PC3H7Y9 PC3H7AD PC3H7Y0 Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. ...
Page 6
Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 200 150 100 50 0 − Ambient temperature T Fig.5 ...
Page 7
Fig.7 Current Transfer Ratio vs. Forward Current 500 400 300 200 100 0 0.1 1 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150% =1mA 100% 50% 0% −20 − Ambient ...
Page 8
Fig.13 Test Circuit for Response Time Input Output Output Input Please refer to the conditions in Fig.12 Remarks : Please be aware that all data in the graph ...
Page 9
Design Considerations ■ Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, ...
Page 10
Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
Page 11
Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...
Page 12
Package specification ● Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 12.0 H ±0.1 7.5 Reel structure and ...
Page 13
Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...