PC817X7 Sharp Microelectronics, PC817X7 Datasheet
PC817X7
Specifications of PC817X7
Related parts for PC817X7
PC817X7 Summary of contents
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PC817X Series ∗ 4-channel package type is also available. (model No. PC847X Series) ■ Description PC817X Series contains an IRED optically coupled to a phototransistor packaged in a 4pin DIP, available in wide-lead spacing option and SMT gullwing ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions 1. Through-Hole [ex. PC817X] Rank mark Anode mark Factory identification mark Date code C817 2 3 ±0.5 6.5 ±0.3 7.62 Epoxy resin ±0.1 0.26 θ θ θ : ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
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... PC817X1 PC817XF1 PC817X2 PC817XF2 PC817X3 PC817XF3 PC817X4 PC817XF4 Model No. PC817X5 PC817XF5 PC817X6 PC817XF6 PC817X7 PC817XF7 PC817X8 PC817XF8 PC817X9 PC817XF9 PC817X0 PC817XF0 Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. SMT Gullwing Wide SMT Gullwing Taping 2 000pcs/reel ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 − Ambient temperature T ...
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Fig.7 Forward Current vs. Forward Voltage 500 =75˚ 200 50˚C 100 0.5 1.0 1.5 2.0 Forward voltage V Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150% =1mA ...
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Fig.13 Response Time vs. Load Resistance 500 = =2mA I 200 C =25˚ 100 0.5 0.2 0.1 0.01 0.1 1 Load resistance R Fig.15 Frequency Response ...
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Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...
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Package specification ● Sleeve package 1. Through-Hole or SMT Gullwing Lead-Form Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed ...
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Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.4 ...
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Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 24.0 11.5 H ±0.1 12.4 0.4 Reel structure and Dimensions e ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...