TLP624(LF1) Toshiba, TLP624(LF1) Datasheet - Page 56
![no-image](/images/manufacturer_photos/0/6/668/toshiba_sml.jpg)
TLP624(LF1)
Manufacturer Part Number
TLP624(LF1)
Description
PHOTOCOUPLER TRANS-OUT 4-SMD
Manufacturer
Toshiba
Specifications of TLP624(LF1)
Number Of Channels
1
Input Type
DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
100% @ 1mA
Current Transfer Ratio (max)
1200% @ 1mA
Voltage - Output
55V
Current - Output / Channel
50mA
Current - Dc Forward (if)
60mA
Vce Saturation (max)
400mV
Output Type
Transistor
Mounting Type
Surface Mount
Package / Case
4-SMD (300 mil)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
TLP624LF1
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8
Below are the example land patterns for surface-mount packages.
Surface-Mount Lead-Formed Photocouplers
Mini-flat and SOP couplers
Example:
1
MFSOP6 (4-Pin) [e.g., TLP181]
(LF1)&(LF5) [e.g., TLP734(LF1)]
SO6 (4-Pin) [e.g., TLP265J]
2.54SOP4 [e.g., TLP197G]
Board Assembly
For the example land patterns for the TLP781, see its datasheet.
Example Land Patterns
1.5
6-pin DIP package
0.8
2.54
2.54
2.54
SO8 [e.g., TLP2105]
1.27
1.27
MFSOP6 (5-Pin) [e.g., TLP114A]
(LF4) [e.g., TLP734(LF4)]
1.5
1.27
0.8
2.54
0.8
1.27
2.54
1.27
2.54
Unit: mm
56
SOP4 [e.g., TLP280]
Example:
0.8
1.27
SDIP6 [e.g., TLP719]
6-pin SDIP package
0.8
1.27 1.27
SO6 (5-Pin) [e.g., TLP109]
1.27
2.54
SSOP4 [e.g., TLP3213]
1.27
SDIP6 (F type) [e.g., TLP719F]
0.8
3.73
0.8
1.27 1.27
0.95
Unit: mm
Unit: mm
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