VO3062 Vishay, VO3062 Datasheet - Page 2

• Manufacturer Part Number: VO3062
• Description: PHOTOTRIAC ZC 600V 10MA 6DIP
• Manufacturer: Vishay

Specifications of VO3062

• Isolation Voltage: 5300 Vrms
• Voltage - Isolation: 5300Vrms
• Number Of Channels: 1
• Voltage - Off State: 600V
• Output Type: AC, Triac, Zero Cross
• Current - Gate Trigger (igt) (max): 10mA
• Current - Hold (ih): 200µA
• Current - Dc Forward (if): 60mA
• Current - Output / Channel: 100mA
• Mounting Type: Through Hole
• Package / Case: 6-DIP (0.300", 7.62mm)
• Configuration: 1
• Maximum Continuous Output Current: 100 mA
• Maximum Input Current: 60 mA
• Maximum Operating Temperature: + 100 C
• Maximum Power Dissipation: 300 mW
• Maximum Reverse Diode Voltage: 6 V
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Typical Input Voltage: 1.2 V
• Zero-crossing Circuit: Yes
• Output Device: Triac
• Peak Output Voltage (vdrm): 600 V
• Maximum Input Voltage: 1.5 V
• Maximum Output Voltage: 420 VAC
• Minimum Trigger Current: 10 mA (Max)
• No. Of Channels: 1
• Optocoupler Output Type: Phototriac
• Input Current: 30mA
• Output Voltage: 600V
• Opto Case Style: DIP
• No. Of Pins: 6
• Input Current Max: 30mA
• Forward Voltage: 1.2V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 751-1382-5; VO3062

VO3062, VO3063
Vishay Semiconductors
Notes
(1)
(2)
Note
The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the
temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of PCB,
layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay’s Thermal Characteristics of
Optocouplers application note.
www.vishay.com
928
ABSOLUTE MAXIMUM RATINGS
PARAMETER
COUPLER
Isolation test voltage
Total power dissipation
Operating temperature range
Storage temperature range
Soldering temperature
THERMAL CHARACTERISTICS
PARAMETER
Maximum LED junction temperature
Maximum output die junction temperature
Thermal resistance, junction emitter to board
Thermal resistance, junction emitter to case
Thermal resistance, junction detector to board
Thermal resistance, junction detector to case
Thermal resistance, junction emitter to
junction detector
Thermal resistance, case to ambient
ELECTRICAL CHARACTERISTCS
PARAMETER
INPUT
Reverse current
Forward voltage
OUTPUT
Leakage with LED off, either direction
Critical rate of rise off-state voltage
T
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum
ratings for extended periods of the time can adversely affect reliability.
Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through
hole devices (DIP).
amb
= 25 °C, unless otherwise specified.
(2)
For technical questions, contact:
TEST CONDITION
TEST CONDITION
V
maximum ≤ 10 s
V
I
DRM
SYMBOL
F
V
D
(1)
= 30 mA
R
T
T
θ
θ
θ
θ
θ
= 400 V
θ
jmax.
jmax.
t = 1 s
JEB
JEC
JDB
JDC
JED
= 6 V
= 600 V
CA
Phototriac, Zero Crossing,
1.5 kV/µs dV/dt, 600 V
VALUE
3563
125
125
150
139
103
496
78
[e-mail]
PART
PART
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
UNIT
°C
°C
SYMBOL
dV/dt
I
DRM
V
I
R
F
SYMBOL
V
T
P
T
T
amb
ISO
stg
sld
tot
T
1500
19996
MIN.
JD
θ
DB
θ
DC
- 40 to + 100
- 55 to + 150
TYP.
2000
T
T
T
VALUE
B
1.2
C
A
θ
10
5300
DE
Document Number: 83748
300
260
T
θ
θ
A
CA
BA
Package
Rev. 1.8, 03-Sep-09
θ
EC
MAX.
θ
EB
500
1.5
10
T
JE
UNIT
V
mW
°C
°C
°C
RMS
UNIT
V/µs
µA
nA
V