TLP3023(S) Toshiba, TLP3023(S) Datasheet - Page 9
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TLP3023(S)
Manufacturer Part Number
TLP3023(S)
Description
PHOTOCOUPLER TRIAC OUT 6-DIP
Manufacturer
Toshiba
Specifications of TLP3023(S)
Voltage - Isolation
5000Vrms
Number Of Channels
1
Voltage - Off State
400V
Output Type
AC, Triac, Standard
Current - Gate Trigger (igt) (max)
5mA
Current - Hold (ih)
600µA
Current - Dc Forward (if)
20mA
Current - Output / Channel
100mA
Mounting Type
Through Hole
Package / Case
6-DIP
No. Of Channels
1
Isolation Voltage
5kV
Optocoupler Output Type
Phototriac
Input Current
20mA
Output Voltage
400V
Opto Case Style
DIP
No. Of Pins
6
Approval Bodies
UL
Operating Temperature Range
-40°C
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
TLP3023S
Photocoupler Product Tree
3
DIP8
Package
Photocoupler Product Tree
DIP4
Photorelays
Photorelays
2.54SOP4
Triac Output
Thyristor- and Triac-Output
DIP16
SOP4
SO8
2.54SOP6
ZC
DIP6
Transistor-Output
Thyristor Output
SDIP6
SO6
SO16
SOP16
MFSOP6
2.54SOP8
SSOP4
USOP4
Transistor-Output
Output Choices
2.54SOP4
2.54SOP8
MFSOP6
SSOP4
USOP4
SOP16
SDIP6
SOP4
SO16
DIP4
DIP8
SO6
SO8
9
Darlington-Transistor Output
Photovoltaic-Output
Photovoltaic-Output
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2.54SOP6
≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness
6-pin SMD package (1.27-mm lead pitch)
≥ 5-mm clearance/creepage; ≥ 0.4-mm isolation thickness
5-pin SMD package (1.27-mm lead pitch); low-profile
8-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
4-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
SMD package (1.27-mm lead pitch)
SMD package (2.54-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
DIP16
DIP6
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General-purpose packages
Lead-forming options for surface mounting
Logic Output
Gate Drive
IC-Output
GND
GND
Vcc
V
CC