76650-0232 Molex Inc, 76650-0232 Datasheet

KIT CONN HIGH SPEED B-B 6PC

76650-0232

Manufacturer Part Number
76650-0232
Description
KIT CONN HIGH SPEED B-B 6PC
Manufacturer
Molex Inc
Series
Plateau HS Mezz™, SEARAY, SEARAY Slimr
Datasheets
1.75005-0306.pdf (7 pages)
2.75005-0306.pdf (9 pages)
3.75005-0306.pdf (12 pages)
4.76650-0232.pdf (3 pages)

Specifications of 76650-0232

Kit Type
Board to Board - Arrays, Edge Type, Mezzanine
Values
6 pcs - Assorted Connector, Plug, Receptacle
Kit Contents
(1) 46556-4145-ND - CONN SNGL-END ARRAY MALE 160POS(1) WM17215-ND - CONN PLUG 48POS 1.2MM VERT SMD(1) WM17206CT-ND - CONN RECEPT 48POS 1.2MM VERT SMD
Product Type
Kits
Mounting Style
Wire, PCB
Mounting Angle
Vertical
Number Of Positions / Contacts
40 to 300
Voltage Rating
30 V to 240 V
Current Rating
1.5 A to 2.7 A
Pitch
1.2 mm
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
Plateau HS Mezz, SEARAY, SEARAY Slim Connectors
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
076650-0232
076650-0232-E
0766500232
0766500232-E
76650-0232-E
766500232
766500232-E
WM9036
REVISION:
DOCUMENT NUMBER:
B
TS-75005-001
ECR/ECN INFORMATION:
EC No:
DATE:
UCP2003-2204
2003 / 04 / 10
75005 Receptacle Assembly
BOARD TO BOARD CONNECTOR
1.0
2.0
3.0
4.0
5.0
Appendix A - Cross Sections from Test Sequence E
Appendix B - Test Setup and Components
HIGH SPEED MEZZANINE
HIGH SPEED MEZZANINE
Scope
Product Description
Applicable Documents and Specifications
Test Sequences
4.1 Sample Preparation
4.2 EIA Test Sequences
4.3 Additional Sequences
Test Results
5.1 EIA Testing
5.2 Additional Testing
5.3 High Speed Electrical Testing
TITLE:
CREATED / REVISED BY:
TEST SUMMARY
Ken Stiles
Table of Contents
BOARD TO BOARD CONNECTOR SYSTEM
TEST SUMMARY FOR THE
HIGH SPEED MEZZANINE
75003 Plug Assembly
CHECKED BY:
Ken Stiles
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
Manny Banakis
APPROVED BY:
SHEET No.
1
of
20

76650-0232 Summary of contents

Page 1

HIGH SPEED MEZZANINE BOARD TO BOARD CONNECTOR 75005 Receptacle Assembly 1.0 2.0 3.0 4.0 5.0 Appendix A - Cross Sections from Test Sequence E Appendix B - Test Setup and Components REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: B DATE: 2003 ...

Page 2

... High Speed Mezzanine Plug Sales Drawing SD-75005-001 High Speed Mezzanine Receptacle Sales Drawing PS-75005-001 High Speed Mezzanine Product Specification AS-75005-001 High Speed Mezzanine Application Specification EIA 364-1000.01 EIA Environmental Test Methodology for Electrical Connectors ASTM D 3359-78 Adhesion Tape Test REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: B ...

Page 3

... Individual Ground Assemblies. (75005-0006 and 75003-0008) 3) The sample size for sequence 4 also included 2 high speed test boards with assemblies that will be sent through the entire sequence. The boards will be checked for any change in the High Speed performance of the connectors. REVISION: ECR/ECN INFORMATION: ...

Page 4

HIGH SPEED MEZZANINE 4.3 Additional Testing Test or Examination Dielectric Withstanding Voltage (5.2.2) Insulation Resistance (5.2.3) Thermal Shock (5.4.1) Humidity - Temp. Cycling (5.4.4) Temperature Rise (5.4.8) Mating Force (5.3.1) Unmating Force (5.3.1) Retention Force - Chicklet to Housing (5.3.6) ...

Page 5

HIGH SPEED MEZZANINE 5.0 Testing Sequences 5.1 EIA 364-1000.01 Results Treatment After Durability After Thermal Aging Treatment After Durability After Thermal Shock After Cyclic Humidity After Reseating Treatment After Durability After Thermal Aging After Vibration REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC ...

Page 6

HIGH SPEED MEZZANINE Treatment After Durability After Thermal Aging After FMG After Thermal Disturbance After Reseating Treatment After Durability After Thermal Aging After Thermal Cycling After Reseating REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: B DATE: 2003 / ...

Page 7

HIGH SPEED MEZZANINE Additional Testing Results 5.2 Dielectric Withstanding Voltage Insulation Resistance Temperature Rise Treatment Mating Force Unmating Force Treatment 75003 Plug Assembly 75005 Recp Assembly REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: B DATE: 2003 / DOCUMENT ...

Page 8

HIGH SPEED MEZZANINE Treatment Requirement Board Thickness # of Pairs EIA 364 Test Samples 80.07 N MIN Unstressed 50% Fill Unstressed 100% Fill Unstressed 100% Fill Soldered locating Pegs Stressed 100% Fill Reworked Treatment EIA 364 Test Samples 53.37 N ...

Page 9

HIGH SPEED MEZZANINE 5.3 High Speed Electrical Testing Results Test Impedance Propagation Delay Near-End Cross Talk NEXT Bandwidth (Insertion Loss) Bandwidth (Return Loss) Note: 1) All Performance Data includes systems effects including via’s and transmission line loss ...

Page 10

HIGH SPEED MEZZANINE Impedance Pre and Post FMG Impedance Pre and Post FMG HS Mez Pair TDR @ 77 ps 10/ Mez Pair TDR @ 77 ps 10/ Mez 12 ...

Page 11

HIGH SPEED MEZZANINE Appendix A - Cross Sections from Test Sequence E Typical 75005 Solder Joint Typical 75005 Solder Joint REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: B DATE: 2003 / DOCUMENT NUMBER: TS-75005-001 TEST SUMMARY EIA Sequence ...

Page 12

HIGH SPEED MEZZANINE Typical 75005 Solder Joint Typical 75005 Solder Joint REVISION: ECR/ECN INFORMATION: EC No: UCP2003-2204 B DATE: 2003 / DOCUMENT NUMBER: TS-75005-001 TEST SUMMARY EIA Sequence 3 Typical 75003 Solder Joint EIA Sequence 4 Typical ...