HYS72T128420HFA-3S-B Qimonda, HYS72T128420HFA-3S-B Datasheet - Page 36

• Manufacturer Part Number: HYS72T128420HFA-3S-B
• Description: MODULE DDR2 1GB 240-DIMM
• Manufacturer: Qimonda

Specifications of HYS72T128420HFA-3S-B

• Memory Type: DDR2 SDRAM
• Memory Size: 1GB
• Speed: 333MHz
• Package / Case: 240-DIMM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 675-1030

8
All Components are surface mounted on one or both sides of
the PCB and positioned on the PCB to meet the minimum and
maximum trace lengths required for DDR2 SDRAM signals.
Bypass capacitors for DDR2 SDRAM devices are located
1) Thickness includes Qimonda Heat Sink. Some early production modules with Jedec Heatspreader may be thicker up to
8.2mm.
Attention: Heat Sink heat up during operation. When unplugging a DIMM from a system direct skin contact should be
Attention: The Heat Sink is mechanically loaded. Do not remove. Removal of the clip may cause injuries.
Attention: Any mechanical stress on the Heat Sink should be avoided. Touching the Heat Sink while plugging or
Rev. 1.00, 2006-10
10062006-RQWY-GI6S
JEDEC Raw Card
R/C A
R/C B
R/C H
avoided until the Heat Sink has reached room temperature.
unplugging the module may permanently damage the DIMM.
Package Outline
Qimonda PCB
L-DIM-240-21
L-DIM-240-22
L-DIM-240-25
Figure 4
Figure 5
Figure 6
Dimensions
Width [mm]
133.35
133.35
133.35
36
near the device power pins. The AMB device in the center of
the DIMM has a metal Heat Sink. The FB-DIMM mechanical
outlines are consistent with JEDEC MO-256.
HYS72T[64/128/256]4[00/20]HFA–[3S/3.7]–B
Height [mm]
30.35
30.35
30.35
Thickness [mm]
8.2
8.2
8.2
Raw Card Reference
Internet Data Sheet
TABLE 19
Notes
1)
1)
1)