MT16VDDF12864HY-40BF2 Micron Technology Inc, MT16VDDF12864HY-40BF2 Datasheet - Page 22
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MT16VDDF12864HY-40BF2
Manufacturer Part Number
MT16VDDF12864HY-40BF2
Description
MODULE DDR 1GB 200-SODIMM
Manufacturer
Micron Technology Inc
Specifications of MT16VDDF12864HY-40BF2
Memory Type
DDR SDRAM
Memory Size
1GB
Speed
400MT/s
Package / Case
200-SODIMM
Main Category
DRAM Module
Sub-category
DDR SDRAM
Module Type
200SODIMM
Device Core Size
64b
Organization
128Mx64
Total Density
1GByte
Chip Density
512Mb
Maximum Clock Rate
400MHz
Operating Supply Voltage (typ)
2.6V
Operating Current
1.6A
Number Of Elements
16
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.5V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
200
Mounting
Socket
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
NOTE:
pdf: 09005aef80b57837, source: 09005aef80b577fa
DDAF16C64_128x64HG.fm - Rev. D 9/04 EN
1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM) across all modules.
2. The component case temperature measurements shown above were obtained experimentally. The typical system to be
3. Temperature versus air speed data is obtained by performing experiments with the system motherboard removed from
4. The memory diagnostic software used for determining worst-case component temperatures is a memory diagnostic soft-
used for experimental purposes is a dual-processor 600 MHz work station, fully loaded, with four comparable registered
memory modules. Case temperatures charted represent worst-case component locations on modules installed in the
internal slots of the system.
its case and mounted in a Eiffel-type low air speed wind tunnel. Peripheral devices installed on the system motherboard
for testing are the processor(s) and video card, all other peripheral devices are mounted outside of the wind tunnel test
chamber.
ware application developed for internal use by Micron Technology, Inc.
100
90
80
70
60
50
40
30
20
Figure 11: Component Case Temperature vs. Air Flow
T
T
max
ave
- memory stress software
- memory stress software
T
ave
Air Flow (meters/sec)
- 3D gaming software
22
512MB, 1GB (x64, DR) PC3200
Micron Technology, Inc., reserves the right to change products or specifications without notice.
200-PIN DDR SODIMM
Ambient Temperature = 25º C
Minimum Air Flow
©2004 Micron Technology, Inc.