MT9VDDT6472HG-335D2 Micron Technology Inc, MT9VDDT6472HG-335D2 Datasheet
MT9VDDT6472HG-335D2
Specifications of MT9VDDT6472HG-335D2
Related parts for MT9VDDT6472HG-335D2
MT9VDDT6472HG-335D2 Summary of contents
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ECC, SR) 200-Pin DDR SDRAM SODIMM DDR SDRAM SODIMM MT9VDDT1672H – 128MB MT9VDDT3272H – 256MB MT9VDDT6472H – 512MB For component data sheets, refer to Micron’s Web site: Features • 200-pin, small-outline dual in-line memory module (SODIMM) ...
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... RCD and RP for -335 modules show 18ns to align with industry specifications; 128MB 4K 8K (A0–A11) 4 (BA0, BA1) 128Mb (16 Meg x 8) 256Mb (32 Meg (A0–A9) 1 (S0#) 1 128Mb DDR SDRAM Module Configuration Bandwidth 16 Meg ...
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... MT9VDDT6472HY-335__ 512MB MT9VDDT6472HG-26A__ 512MB MT9VDDT6472HG-265__ 512MB Notes: 1. Data sheets for the base devices can be found on Micron’s Web site. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT9VDDT6472HY-335F2. ...
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ECC, SR) 200-Pin DDR SDRAM SODIMM Pin Assignments and Descriptions Table 6: Pin Assignments 200-Pin SODIMM Front Pin Symbol Pin Symbol Pin 101 REF DQ19 103 SS 5 ...
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ECC, SR) 200-Pin DDR SDRAM SODIMM Table 7: Pin Descriptions Symbol A0–A12 BA0, BA1 CK0, CK0#, CK1, CK1# CK2, CK2# CKE0 DM0–DM8 RAS#, CAS#, WE# S0# SA0–SA2 SCL CB0–CB7 DQ0–DQ63 DQS0–DQS8 SDA DDSPD ...
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ECC, SR) 200-Pin DDR SDRAM SODIMM Functional Block Diagrams Figure 3: Functional Block Diagram – Low-Profile Layout S0# DQS0 DM0 DQS1 DM1 DQS2 DM2 DQS3 DM3 DQS8 DM8 BA0, BA1 A0–A11/A12 PDF: 09005aef80804052/Source: 09005aef806e057b DD9C16_32_64x72H.fm - ...
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ECC, SR) 200-Pin DDR SDRAM SODIMM Figure 4: Functional Block Diagram – Standard Layout S0# DQS0 DM0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQS1 DM1 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQS2 ...
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... READs and by the memory controller during WRITEs. DQS is edge-aligned with data for READs and center-aligned with data for WRITEs. DDR SDRAM modules operate from differential clock inputs (CK and CK#); the crossing of CK going HIGH and CK# going LOW will be referred to as the positive edge of CK. ...
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... Simulations are significantly more accurate and realistic than a gross estimation of module capacitance when inductance and delay parameters associated with trace lengths are used in simulations. JEDEC modules are currently designed using simulations to close timing budgets. Component AC Timing and Operating Conditions Recommended AC operating conditions are given in the DDR component data sheets. Component specifications are available on Micron’ ...
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ECC, SR) 200-Pin DDR SDRAM SODIMM I Specifications DD Table 10: I Specifications and Conditions – 128MB DD Values are shown for the MT46V16M8 DDR SDRAM only and are computed from values specified in the 128Mb ...
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ECC, SR) 200-Pin DDR SDRAM SODIMM Table 11: I Specifications and Conditions – 256MB DD Values are shown for the MT46V32M8 DDR SDRAM only and are computed from values specified in the 256Mb (32 Meg x ...
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ECC, SR) 200-Pin DDR SDRAM SODIMM Table 12: I Specifications and Conditions – 512MB DD Values are shown for MT46V64M8 DDR SDRAM only and are computed from values specified in the 512Mb (64 Meg x 8) ...
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ECC, SR) 200-Pin DDR SDRAM SODIMM Serial Presence-Detect Table 13: Serial Presence-Detect EEPROM DC Operating Conditions Parameter/Condition Supply voltage Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output low voltage: ...
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ECC, SR) 200-Pin DDR SDRAM SODIMM Module Dimensions Figure 5: 200-Pin SODIMM – Low-Profile Layout 2.0 (0.079) R (2X) U1 1.8 (0.071) (2X) 6.0 (0.236) TYP 2.44 (0.096) TYP 2.0 (0.079) TYP 0.99 (0.039) U6 Pin ...
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Figure 6: 200-Pin SODIMM – Standard Layout U1 2.0 (0.079) R (2X) 1.8 (0.071) (2X) 6.0 (0.236) TYP 2.44 (0.096) TYP 2.0 (0.079) TYP 0.99 (0.039) U6 Pin 200 Notes: 1. All dimensions are in millimeters (inches); MAX/MIN or typical ...