MT8VDDT6464HDG-335F2 Micron Technology Inc, MT8VDDT6464HDG-335F2 Datasheet - Page 12

• Manufacturer Part Number: MT8VDDT6464HDG-335F2
• Description: MODULE DDR 512MB 200-SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT8VDDT6464HDG-335F2

• Memory Type: DDR SDRAM
• Memory Size: 512MB
• Speed: 333MT/s
• Package / Case: 200-SODIMM
• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 200SODIMM
• Device Core Size: 64b
• Organization: 64Mx64
• Total Density: 512MByte
• Chip Density: 512Mb
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Operating Current: 800mA
• Number Of Elements: 8
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 200
• Mounting: Socket
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Absolute Maximum Ratings
nent damage to the device. This is a stress rating only,
and functional operation of the device at these or any
other conditions above those indicated in the opera-
Table 10: DC Electrical Characteristics and Operating Conditions
Notes: 1–5, 14; notes appear on pages 17–20; 0°C ≤ T
Table 11: AC Input Operating Conditions
Notes: 1–5, 14, 48; notes appear on pages 17–20; 0°C ≤ T
pdf: 09005aef80b575ca, source: 09005aef806e1d28
DDA8C32_64x64HDG.fm - Rev. D 9/04 EN
PARAMETER/CONDITION
PARAMETER/CONDITION
Supply Voltage
I/O Supply Voltage
I/O Reference Voltage
I/O Termination Voltage (system)
Input High (Logic 1) Voltage
Input Low (Logic 0) Voltage
INPUT LEAKAGE CURRENT
Any input 0V ≤ V
(All other pins not under test = 0V)
OUTPUT LEAKAGE CURRENT
(DQ pins are disabled; 0V ≤ V
OUTPUT LEVELS
High Current (V
Low Current (V
OUTPUT LEVELS: Reduced drive option
High Current (V
Low Current (V
Input High (Logic 1) Voltage
Input Low (Logic 0) Voltage
I/O Reference Voltage
Stresses greater than those listed may cause perma-
Voltage on V
Voltage on V
Voltage on V
Relative to V
Relative to V
Relative to V
OUT
OUT
OUT
REF
OUT
DD
DD
IN
≤ V
SS
SS
SS
Q Supply
Supply
= 0.373V, maximum V
= V
= 0.763V, maximum V
and Inputs
= V
. . . . . . . . . . . . . . . . . . . . . -1V to +3.6V
. . . . . . . . . . . . . . . . . . . . -1V to +3.6V
. . . . . . . . . . . . . . . . . . . . -1V to +3.6V
DD
DD
DD
, Vref pin 0V ≤ V
Q -0.763V, minimum V
Q-0.373V, minimum V
OUT
≤ V
DD
IN
Q)
≤ 1.35V
REF
REF
, maximum V
,maximum V
REF
REF
SYMBOL
Command/
Address, RAS#,
CAS#, WE#
CK, CK#, CKE
DM
DQ, DQS
, minimum V
, minimum V
V
V
V
REF
IH
IL
A
(
(
≤ +70°C
AC
(
AC
AC
A
)
)
TT
)
TT
≤ +70°C; V
)
)
12
TT
TT
)
)
tional sections of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
256MB, 512MB (x64, DR) PC3200
0.49 × V
V
SYMBOL
Voltage on I/O Pins
Operating Temperature,
Storage Temperature (plastic) . . . . . . -55°C to +150°C
Short Circuit Output Current. . . . . . . . . . . . . . . 50mA
V
REF
V
DD
V
V
I
IH
V
I
IL
V
I
I
OHR
DD
I
OLR
Relative to V
OH
MIN
OZ
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T
REF
OL
DD
(
I
I
I
TT
(
= V
I
I
I
+ 0.310
DC
DC
A
–
Q
(ambient) . . . . . . . . . . . . . . . . . . . .. 0°C to +70°C
)
)
DD
DD
Q = +2.6V ±0.1V
Q
V
V
REF
REF
0.49 ×
V
-16.8
MIN
16.8
-0.3
-16
-10
2.5
2.5
DD
-8
-4
-9
0.51 × V
+ 0.15
9
200-PIN DDR SODIMM
- 0.04 V
V
SS
REF
Q
MAX
. . . . . . . . . . . . -0.5V to V
- 0.310
–
V
DD
V
REF
REF
DD
0.51 ×
V
MAX
Q
2.7
2.7
DD
16
10
+ 0.04
8
4
–
–
- 0.15
+ 0.3
–
–
Q
UNITS
V
V
V
UNITS
mA
mA
mA
mA
µA
µA
µA
µA
V
V
V
V
V
V
©2004 Micron Technology, Inc.
12, 25, 36
12, 25, 36
NOTES
DD
32, 37, 40,
32, 37, 49
NOTES
6
33, 35
34, 35
Q +0.5V
6, 40
7, 40
49
25
25
47
47
47
47