MT18LSDF6472G-133D1 Micron Technology Inc, MT18LSDF6472G-133D1 Datasheet

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MT18LSDF6472G-133D1

Manufacturer Part Number
MT18LSDF6472G-133D1
Description
MODULE SDRAM 512MB 168DIMM
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT18LSDF6472G-133D1

Memory Type
SDRAM
Memory Size
512MB
Speed
133MHz
Package / Case
168-DIMM
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Synchronous DRAM Module
MT18LSDF6472 – 512MB
For the latest data sheet, refer to Micron’s Web site:
Features
• 168-pin, dual in-line memory module (DIMM)
• PC133-compliant
• Registered inputs with one-clock delay
• Phase-lock loop (PLL) clock driver to reduce loading
• Utilizes 133 MHz SDRAM components
• Supports ECC error detection and correction
• 512MB (64 Meg x 72)
• Single +3.3V power supply
• Fully synchronous; all signals registered on positive
• Internal pipelined operation; column address can
• Internal SDRAM banks for hiding row access/
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto precharge, includes concurrent auto precharge
• Auto refresh mode
• Self refresh mode: 64ms, 8,192-cycle refresh
• LVTTL-compatible inputs and outputs
• Serial presence-detect (SPD)
• Gold edge contacts
Table 1:
PDF: 09005aef80a2e32f/Source: 09005aef80d04a5a
SDF18C64x72G.fm - Rev. E 9/05 EN
Module
Marking
edge of PLL clock
be changed every clock cycle
precharge
-13E
-133
Frequency
133 MHz
133 MHz
Timing Parameters
CL = CAS (READ) latency
Clock
Products and specifications discussed herein are subject to change by Micron without notice.
CL = 2
5.4ns
Access Time
CL = 3
5.4ns
Setup
Time
1.5
1.5
Hold
Time
www.micron.com/products/modules
0.8
0.8
512MB (x72, ECC, SR): 168-PIN SDRAM RDIMM
1
Figure 1:
Notes:1. Contact Micron for product availability.
Table 2:
Options
• Package
• Frequency/CAS Latency
• PCB
Standard 1.05in. (26.67mm)
Low-Profile 0.90in. (22.86mm)
Parameter
Refresh count
Device banks
Device configuration
Row addressing
Column addressing
Module ranks
168-pin DIMM (standard)
168-pin DIMM (lead-free)
133 MHz/CL = 2
133 MHz/CL = 3
Standard 1.05in. (26.67mm)
Low-Profile 0.9in. (22.86mm)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. Registered mode adds one clock cycle to CL.
Address Table
168-Pin DIMM (MO-161)
2
©2001 Micron Technology, Inc. All rights reserved.
1
256Mb (64 Meg x 4)
2K (A0–A9, A11)
4 (BA0, BA1)
8K (A0–A12)
See note page 2
See note page 2
1 (S0#, S2#)
Marking
512MB
8K
Features
-13E
-133
Y
G
1

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MT18LSDF6472G-133D1 Summary of contents

Page 1

... MHz – PDF: 09005aef80a2e32f/Source: 09005aef80d04a5a SDF18C64x72G.fm - Rev. E 9/05 EN Products and specifications discussed herein are subject to change by Micron without notice. 512MB (x72, ECC, SR): 168-PIN SDRAM RDIMM www.micron.com/products/modules Figure 1: Standard 1.05in. (26.67mm) Low-Profile 0.90in. (22.86mm) Options • Package 168-pin DIMM (standard) 168-pin DIMM (lead-free) • ...

Page 2

... MT18LSDF6472Y-13E__ MT18LSDF6472G-133__ MT18LSDF6472Y-133__ Notes: 1. The designators for component and PCB revision are the last two characters of each part number. Consult factory for current revision codes. Example: MT18LSDF6472G-133B1. PDF: 09005aef80a2e32f/Source: 09005aef80d04a5a SDF18C64x72G.fm - Rev. E 9/05 EN 512MB (x72, ECC, SR): 168-PIN SDRAM RDIMM Module Density ...

Page 3

Pin Assignments and Descriptions Table 4: Pin Assignments 168-Pin DIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol CB1 DQ0 ...

Page 4

Table 5: Pin Descriptions Pin numbers not listed in correct order; for more information, see Pin Assignment tables on page 3 Pins Symbol 27, 111, 115 WE#, CAS#, RAS# 42 CK0 128 CKE0 30, 45 S0#, S2# 28, 29, 46, ...

Page 5

... Functional Block Diagram Per industry standard, Micron modules utilize various component speed grades, as ref- erenced in the module part number guide at ing.html. Standard modules use the following SDRAM devices: MT48LC64M4A2FB (512MB). Lead-free modules use the following SDRAM devices: MT48LC64M4A2BB (512MB). ...

Page 6

Figure 3: Functional Block Diagram RAS# CAS# CKE0 WE# A0–A12 BA0 BA1 S0#, S2# DQMB0–DQMB7 10K U18 V DD REG PLL CLK Note: All resistor values are 10Ω unless otherwise specified. PDF: 09005aef80a2e32f/Source: 09005aef80d04a5a SDF18C64x72G.fm - Rev. E 9/05 EN ...

Page 7

... READ or WRITE command are used to select the starting device column location for the burst access. SDRAM modules provide for programmable read or write locations, or full page, with a burst terminate option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. ...

Page 8

DIMM’s SCL (clock) and SDA (data) signals, together with SA (2:0), which provide eight unique DIMM/EEPROM addresses. Write protect (WP) is tied to ground on the module, permanently disabling hardware write protect. Initialization SDRAMs must be powered ...

Page 9

The ordering of accesses within a burst is determined by BL, the burst type and the start- ing column address, as shown in Table 6. Burst Type Accesses within a given burst may be programmed to be either sequential or ...

Page 10

Table 6: Burst Definition Table Burst Length Full Page Notes: 1. For full-page accesses 2,048. 2. For A1–A9, A11 select the block-of-two burst; A0 selects the starting column within the block. 3. For BL = ...

Page 11

Figure 5: CAS Latency Diagram COMMAND COMMAND CAS Latency CL is the delay, in clock cycles, between the registration of a READ command and the availability of the first piece of output data. The latency can be set to two ...

Page 12

Figure 6: CAS Latency Table Registered mode adds one clock cycle to CL Speed -13E -133 Commands Table 7, provides a quick reference of available commands. This is followed by written description of each command. For a more detailed description ...

Page 13

Electrical Specifications Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of ...

Page 14

Table 10: Capacitance Note 2; notes appear on pages 16 and 17 Parameter Input capacitance: Address and command Input capacitance: S#, DQMB Input capacitance: CK Input/Output capacitance: DQ Table 11: Electrical Characteristics and Recommended AC Operating Conditions Notes ...

Page 15

Table 12 Functional Characteristics Notes 11, 31; notes appear on pages 16 and 17 Parameter READ/WRITE command to READ/WRITE command CKE to clock disable or power-down entry mode CKE to clock enable or ...

Page 16

Notes 1. All voltages referenced This parameter is sampled. V biased at 1.4V with minimum cycle time and the outputs open. 4. Enables on-chip refresh and address counters. 5. The minimum specifications are used ...

Page 17

... SDF18C64x72G.fm - Rev. E 9/05 EN 512MB (x72, ECC, SR): 168-PIN SDRAM RDIMM t WR, and PRECHARGE commands). CKE may 7.5ns; and for -133 and t RAS used in -13E speed grade modules is calculated from 45ns. Micron Technology, Inc., reserves the right to change products or specifications without notice. 17 Notes t RP) begins at 7ns for -13E ...

Page 18

PLL and Register Specifications Table 13: Register Timing Requirements and Switching Characteristics Register Symbol f clock t Propagation delay, Single rank pd1 SSTL t Propagation delay, Dual rank pd2 bit pattern by JESD82 Table ...

Page 19

Serial Presence-Detect SPD Clock and Data Conventions Data states on the SDA line can change only during SCL LOW. SDA state changes during SCL HIGH are reserved for indicating start and stop conditions (as shown in Figure 8, and Figure ...

Page 20

Figure 9: Definition of Start and Stop SCL SDA Figure 10: Acknowledge Response From Receiver SCL from Master Data Output from Transmitter Data Output from Receiver Table 15: EEPROM Device Select Code The most significant bit (b7) is sent first ...

Page 21

Figure 11: SPD EEPROM Timing Diagram SCL t SU:STA SDA IN SDA OUT Table 17: Serial Presence-Detect EEPROM DC Operating Conditions All voltages referenced to V Parameter/Condition Supply voltage Input high voltage: Logic 1; All inputs Input low voltage: Logic ...

Page 22

Table 18: Serial Presence-Detect EEPROM AC Operating Conditions All voltages referenced to V Parameter/Condition SCL LOW to SDA data-out valid Time the bus must be free before a new transition can start Data-out hold time SDA and SCL fall time ...

Page 23

Table 19: Serial Presence-Detect Matrix “1”/”0”: Serial data, “driven to HIGH”/”driven to LOW”; V Byte Description 0 Number of bytes used by Micron 1 Total number of SPD memory bytes 2 Memory type 3 Number of row addresses 4 Number ...

Page 24

... ECC, SR): 168-PIN SDRAM RDIMM = +3.3V ±0.3V DD Entry (Version 66ns (-13E) 71ns (-133) MICRON 100 MHz (-13E/ -133) t RAS used for -13E modules is calculated from Micron Technology, Inc., reserves the right to change products or specifications without notice. 24 Serial Presence-Detect MT18LSDF6472 REV. 2.0 02 -13E ...

Page 25

Figure 12: 168-Pin DIMM Dimensions – Standard PCB 0.079 (2.00) R (2X 0.118 (3.00) (2X) 0.18 (3.00) 0.250 (6.35) PIN 1 0.118 (3.00) U12 U13 U14 PIN 168 Note: All dimensions are in inches (millimeters); PDF: 09005aef80a2e32f/Source: ...

Page 26

Figure 13: 168-Pin DIMM Dimensions – Low-Profile 0.079 (2.00) R (2X 0.118 (3.00) (2X) 0.118 (3.00) 0.250 (6.35) PIN 1 0.118 (3.00) U12 U13 U14 PIN 168 Note: All dimensions are in inches (millimeters); 8000 S. Federal ...

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