MT36LSDF12872G-133D1 Micron Technology Inc, MT36LSDF12872G-133D1 Datasheet - Page 22

• Manufacturer Part Number: MT36LSDF12872G-133D1
• Description: MODULE SDRAM 1GB 168DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT36LSDF12872G-133D1

• Memory Type: SDRAM
• Memory Size: 1GB
• Speed: 133MHz
• Package / Case: 168-DIMM
• Main Category: DRAM Module
• Sub-category: SDRAM
• Module Type: 168RDIMM
• Device Core Size: 72b
• Organization: 128Mx72
• Total Density: 1GByte
• Chip Density: 256Mb
• Access Time (max): 6/5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Current: 2.466A
• Number Of Elements: 36
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 65C
• Operating Temperature Classification: Commercial
• Pin Count: 168
• Mounting: Socket
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Figure 7:
PDF: 09005aef80b1835d/Source: 09005aef80b18348
SD36C128_256x72G.fm - Rev. E 6/05 EN
100
Component Case Temperature vs. Airflow
90
80
70
60
50
40
30
20
Notes: 1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM)
2. The component case temperature measurements shown above are obtained experimen-
3. Temperature versus air speed data is obtained by performing experiments with the system
4. The memory diagnostic software used for determining worst-case component tempera-
across all modules when installed in a system.
tally. The system used for experimental purposes is a dual-processor 600 MHz work station,
fully loaded with four MT36LSDT12872G modules. Case temperatures charted represent
worst-case component locations on modules installed in the internal slots of the system.
motherboard removed from its case and mounted in a Eiffel-type low air speed wind tun-
nel. Peripheral devices installed on the system motherboard for testing are the processor(s)
and video card, all other peripheral devices are mounted outside of the wind tunnel test
chamber.
tures is a memory diagnostic software application developed for internal use by Micron
Technology, Inc.
T
T
max
ave
- memory stress software
- memory stress software
Timing Requirements and Switching Characteristics
T
ave
1GB, 2GB: (x72, ECC, DR) 168-Pin SDRAM RDIMM
Air Flow (meters/sec)
- 3D gaming software
22
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Ambient Temperature = 25º C
Minimum Air Flow
©2002 Micron Technology, Inc. All rights reserved.