MT9VDDT3272G-265G3 Micron Technology Inc, MT9VDDT3272G-265G3 Datasheet - Page 9

• Manufacturer Part Number: MT9VDDT3272G-265G3
• Description: MODULE SDRAM DDR 256MB 184DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT9VDDT3272G-265G3

• Memory Type: DDR SDRAM
• Memory Size: 256MB
• Speed: 266MT/s
• Package / Case: 184-DIMM
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

I
Table 10:
PDF: 09005aef80e119b2/Source: 09005aef80e11976
DD9C16_32_64x72.fm - Rev. D 1/08 EN
Parameter/Condition
Operating one bank active-precharge current:
t
Address and control inputs changing once every two clock cycles
Operating one bank active-read-precharge current: BL = 2;
t
changing once per clock cycle
Precharge power-down standby current: All device banks idle; Power-
down mode;
Idle standby current: CS# = HIGH; All device banks idle;
CKE = HIGH; Address and other control inputs changing once per clock cycle;
V
Active power-down standby current: One device bank active; Power-
down mode;
Active standby current: CS# = HIGH; CKE = HIGH; One device bank active;
t
per clock cycle; Address and other control inputs changing once per clock
cycle
Operating burst read current: BL = 2; Continuous burst reads; One device
bank active; Address and control inputs changing once per clock cycle;
t
Operating burst write current: BL = 2; Continuous burst writes; One
device bank active; Address and control inputs changing once per clock
cycle;
cycle
Auto refresh current
Self refresh current: CKE ≤ 0.2V
Operating bank interleave read current: Four device bank interleaving
reads (BL = 4) with auto precharge;
Address and control inputs change only during active READ or WRITE
commands
DD
CK =
RC =
RC =
CK =
IN
= V
Specifications
t
t
t
t
t
RAS (MAX);
RC (MIN);
CK (MIN); DQ, DM, and DQS inputs changing once per clock cycle;
CK (MIN); I
CK =
REF
for DQ, DM, and DQS
t
CK (MIN); DQ, DM, and DQS inputs changing twice per clock
t
t
I
Values are shown for the MT46V16M8 DDR SDRAM only and are computed from values specified in the
128Mb (16 Meg x 8) component data sheet
CK =
CK =
DD
t
CK =
OUT
Specifications and Conditions – 128MB
t
CK =
t
t
CK (MIN); CKE = LOW
CK (MIN); CKE = LOW
= 0mA
t
CK (MIN); I
t
CK (MIN); DQ, DM, and DQS inputs changing twice
128MB, 256MB, 512MB (x72, ECC, SR) 184-Pin DDR SDRAM RDIMM
OUT
t
RC =
= 0mA; Address and control inputs
t
RC (MIN);
t
RC =
t
CK =
t
t
REFC =
REFC = 15.625µs
t
RC (MIN);
t
t
CK =
CK (MIN);
9
t
RFC (MIN)
t
CK (MIN);
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Symbol
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I
I
I
I
DD
DD
DD
DD
I
I
I
I
DD
DD
DD
I
DD
DD
DD
DD
DD
4W
3N
5A
2P
3P
4R
2F
0
1
5
6
7
Electrical Specifications
1,125
1,215
1,260
1,260
2,385
3,195
-335
405
225
450
27
45
27
©2003 Micron Technology, Inc. All rights reserved
-26A/
1,080
1,125
1,080
1,980
2,925
-265
945
360
180
405
27
45
18
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA